Global Patent Index - EP 1730813 B1

EP 1730813 B1 20070509 - METHOD FOR JOINING A CONNECTING ELEMENT TO AN ELECTRIC CONDUCTOR MADE OF ALUMINIUM AND ELECTRIC CONDUCTOR PRODUCED ACCORDING TO SAID METHOD

Title (en)

METHOD FOR JOINING A CONNECTING ELEMENT TO AN ELECTRIC CONDUCTOR MADE OF ALUMINIUM AND ELECTRIC CONDUCTOR PRODUCED ACCORDING TO SAID METHOD

Title (de)

VERFAHREN ZUR VERBINDUNG EINES ANSCHLUSSELEMENTS MIT EINEM AUS ALUMINIUM BESTEHENDEN ELEKTRISCHEN LEITER SOWIE NACH DIESEM VERFAHREN HERGESTELLTER ELEKTRISCHER LEITER

Title (fr)

PROCEDE POUR RELIER UN ELEMENT DE RACCORDEMENT A UN CONDUCTEUR ELECTRIQUE EN ALUMINIUM ET CONDUCTEUR ELECTRIQUE FABRIQUE SELON CE PROCEDE

Publication

EP 1730813 B1 20070509 (DE)

Application

EP 04789548 A 20041021

Priority

  • AT 2004000358 W 20041021
  • AT 5072004 A 20040323

Abstract (en)

[origin: US2006292922A1] A method for joining a connecting element, which is made of copper or a copper alloy, for a cable, particularly a cable lug, to an electric cable provided with a conductor that is made of aluminium. The connecting element, which is provided with a nickel coating on the surfaces thereof facing away from the aluminium conductor, is welded to the aluminium conductor by way of zinc.

IPC 8 full level

H01R 4/02 (2006.01); H01R 4/62 (2006.01); H01R 43/02 (2006.01); H01R 4/20 (2006.01); H01R 13/03 (2006.01)

CPC (source: EP KR US)

H01R 4/02 (2013.01 - KR); H01R 4/023 (2013.01 - EP US); H01R 4/029 (2013.01 - EP US); H01R 4/10 (2013.01 - KR); H01R 4/625 (2013.01 - EP US); H01R 43/02 (2013.01 - EP US); H01R 4/20 (2013.01 - EP US); H01R 13/03 (2013.01 - EP US); H01R 2201/26 (2013.01 - EP US)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR

DOCDB simple family (publication)

WO 2005091439 A1 20050929; AT E362203 T1 20070615; DE 502004003811 D1 20070621; EP 1730813 A1 20061213; EP 1730813 B1 20070509; ES 2282910 T3 20071016; JP 2007531208 A 20071101; KR 20060129364 A 20061215; US 2006292922 A1 20061228

DOCDB simple family (application)

AT 2004000358 W 20041021; AT 04789548 T 20041021; DE 502004003811 T 20041021; EP 04789548 A 20041021; ES 04789548 T 20041021; JP 2007504201 A 20041021; KR 20067015569 A 20060801; US 51101906 A 20060828