EP 1731562 A4 20090429 - COMPOSITION FOR DIP FORMING AND MOLDING OBTAINED BY DIP FORMING
Title (en)
COMPOSITION FOR DIP FORMING AND MOLDING OBTAINED BY DIP FORMING
Title (de)
ZUSAMMENSETZUNG ZUM TAUCHFORMEN UND DURCH TAUCHFORMEN ERHALTENER FORMKÖRPER
Title (fr)
COMPOSITION POUR LE FORMAGE PAR IMMERSION ET MOULAGE OBTENU PAR FORMAGE PAR IMMERSION
Publication
Application
Priority
- JP 2005005831 W 20050329
- JP 2004103424 A 20040331
Abstract (en)
[origin: EP1731562A1] A dip-forming composition of the present invention comprises a dip-forming latex containing a copolymer obtained by copolymerizing 100 parts by weight of a monomer mixture containing 70 to 85 parts by weight of a conjugated diene monomer, 10 to 28 parts by weight of an aromatic vinyl monomer, 2 to 5 parts by weight of an ethylenically unsaturated acid monomer and 0 to 18 parts by weight of other monomer copolymerizable with these monomers, said copolymer having a toluene insoluble content of 30% by weight or more and a toluene swelling degree of 70 times or less; and a vulcanizing agent, a vulcanization accelerator and zinc oxide which are blended in said latex in amounts of 0.5 to 2 parts by weight, 0.25 to 1 part by weight and 0.5 to 1 part by weight, respectively, on the basis of 100 parts by weight of a solid content of the latex. There can be provided a dip-formed article exhibiting an excellent touch and feel, sufficient tensile strength and elongation at break and an excellent persistence of close fitting, as well as a dip-forming composition capable of providing such a dip-formed article.
IPC 8 full level
C08L 9/08 (2006.01); B29C 41/00 (2006.01); B29C 41/14 (2006.01); C08J 5/02 (2006.01); C08K 3/22 (2006.01)
CPC (source: EP US)
B29C 41/003 (2013.01 - EP US); C08J 5/02 (2013.01 - EP US); C08K 3/011 (2017.12 - EP US); C08K 3/22 (2013.01 - EP US); C08K 5/0025 (2013.01 - EP US); B29C 41/14 (2013.01 - EP US); B29L 2031/4864 (2013.01 - EP US); C08J 2309/08 (2013.01 - EP US); C08J 2313/02 (2013.01 - EP US)
Citation (search report)
- [X] WO 03080722 A1 20031002 - ZEON CORP [JP], et al
- [X] EP 1361247 A1 20031112 - ZEON CORP [JP]
- [DA] WO 9854250 A1 19981203 - REICHHOLD CHEMICALS INC [US], et al
- [A] WO 03029316 A1 20030410 - BASF AG [DE], et al
- [A] GB 1220384 A 19710127 - BAYER AG [DE]
- [A] DATABASE WPI Section Ch Week 200421, Derwent World Patents Index; Class A18, AN 2004-217524, XP002520539
- See references of WO 2005095508A1
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
EP 1731562 A1 20061213; EP 1731562 A4 20090429; EP 1731562 B1 20100609; CN 100537648 C 20090909; CN 1938373 A 20070328; DE 602005021764 D1 20100722; JP WO2005095508 A1 20080221; US 2007149693 A1 20070628; US 7662890 B2 20100216; WO 2005095508 A1 20051013
DOCDB simple family (application)
EP 05727740 A 20050329; CN 200580010826 A 20050329; DE 602005021764 T 20050329; JP 2005005831 W 20050329; JP 2006511660 A 20050329; US 58936605 A 20050329