Global Patent Index - EP 1733855 A1

EP 1733855 A1 20061220 - Flat board stamping apparatus

Title (en)

Flat board stamping apparatus

Title (de)

Vorrichtung zum Stanzen von flächigen Platten

Title (fr)

Dispositif d'estampage de plaques planes

Publication

EP 1733855 A1 20061220 (EN)

Application

EP 06252868 A 20060602

Priority

JP 2005173570 A 20050614

Abstract (en)

The flat board stamping apparatus comprising a stamping portion (3), a stripping portion(4) for stripping off a non-product part from a stamped material, a non-defective stamped product knocking off portion (61) for cutting off a product part, a delivery portion(6) for accommodating therein the product part, a detecting means(8) for detecting a state of the stamped material, a control unit(9) for determining defective condition or non-defective condition of the stamped material with reference to results obtained by the detecting means(8) and, when the stamped material being recognized as defective condition, sending the defective stamped material to a defective stamped material withdrawing portion(5), and a transferring means(7) for transferring a material(10) to be stamped in sequence to the stamping portion(3), the stripping portion(4), the defective stamped material withdrawing portion(5) and the delivery portion(6), is characterized in that the defective stamped material withdrawing portion (5) is provided with a defective stamped material knocking off portion (51) for knocking off a defective product part from the gripper margin, the defective stamped material knocking off portion (51) being arranged at a location upstream from the non-defective stamped material knocking off portion (61), and that, when the control unit (9) recognizing a stamped material transferred by the transferring means (7) as defective condition, the stamped material is controlled by the control unit (9) for sending to the defective stamped material withdrawing portion (5).

IPC 8 full level

B26D 5/00 (2006.01); B26D 7/18 (2006.01); B65H 29/62 (2006.01); B26D 7/00 (2006.01); B26D 7/32 (2006.01); B26F 1/40 (2006.01)

CPC (source: EP)

B26D 5/007 (2013.01); B26D 5/34 (2013.01); B26D 7/18 (2013.01); B65H 29/62 (2013.01); B26D 7/00 (2013.01); B26D 7/32 (2013.01); B26F 1/40 (2013.01)

Citation (search report)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

Designated extension state (EPC)

AL BA HR MK YU

DOCDB simple family (publication)

EP 1733855 A1 20061220; JP 2006346779 A 20061228; JP 4317835 B2 20090819

DOCDB simple family (application)

EP 06252868 A 20060602; JP 2005173570 A 20050614