EP 1736512 A4 20080702 - CONDUCTIVE RESIN COMPOSITION
Title (en)
CONDUCTIVE RESIN COMPOSITION
Title (de)
LEITFÄHIGE HARZZUSAMMENSETZUNG
Title (fr)
COMPOSITION DE RESINE CONDUCTRICE
Publication
Application
Priority
- JP 2005007162 W 20050413
- JP 2004118708 A 20040414
- JP 2004328986 A 20041112
Abstract (en)
[origin: EP1736512A1] Disclosed is a conductive resin composition containing a polyamide, a polyphenylene ether, a polyester and a conductive carbon filler. The resin composition has attained excellent conductivity by being added with a small amount of the conductive carbon filler, while being excellent in fluidity and surface luster. Also disclosed is a molded body formed from such a resin composition.
IPC 8 full level
C08L 77/00 (2006.01); C08J 3/22 (2006.01); C08K 3/04 (2006.01); C08L 67/00 (2006.01); C08L 71/12 (2006.01); C08L 77/02 (2006.01); C08L 77/06 (2006.01)
CPC (source: EP US)
C08J 3/226 (2013.01 - EP US); C08L 67/00 (2013.01 - EP US); C08L 71/12 (2013.01 - EP US); C08L 77/00 (2013.01 - EP US); C08K 3/04 (2013.01 - EP US); C08K 3/041 (2017.04 - EP); C08L 77/02 (2013.01 - EP US); C08L 77/06 (2013.01 - EP US); C08L 2205/03 (2013.01 - EP US)
Citation (search report)
- [Y] US 2003116757 A1 20030626 - MIYOSHI TAKAAKI [JP], et al
- [Y] WO 9945069 A1 19990910 - BASF AG [DE], et al
- [Y] US 2003134963 A1 20030717 - MIYOSHI TAKAAKI [JP], et al
- [XY] EP 1277807 A2 20030122 - MITSUBISHI ENG PLASTICS CORP [JP]
- See references of WO 2005100478A1
Designated contracting state (EPC)
DE FR
DOCDB simple family (publication)
EP 1736512 A1 20061227; EP 1736512 A4 20080702; EP 1736512 B1 20111214; CN 1942523 A 20070404; CN 1942523 B 20101208; JP 4803738 B2 20111026; JP WO2005100478 A1 20080306; US 2007205401 A1 20070906; US 7696274 B2 20100413; WO 2005100478 A1 20051027
DOCDB simple family (application)
EP 05730592 A 20050413; CN 200580010975 A 20050413; JP 2005007162 W 20050413; JP 2006512358 A 20050413; US 59349605 A 20050413