EP 1736562 A1 20061227 - THICK HIGH STRENGTH STEEL PLATE HAVING EXCELLENT LOW TEMPERATURE TOUGHNESS IN WELDING HEAT AFFECTED ZONE CAUSED BY HIGH HEAT INPUT WELDING
Title (en)
THICK HIGH STRENGTH STEEL PLATE HAVING EXCELLENT LOW TEMPERATURE TOUGHNESS IN WELDING HEAT AFFECTED ZONE CAUSED BY HIGH HEAT INPUT WELDING
Title (de)
DICKE HOCHFESTE STAHLPLATTE MIT HERVORRAGENDER KÄLTEZÄHIGKEIT IN EINER DURCH DIE SCHWEISSWÄRME BEEINFLUSSTEN ZONE INFOLGE VON SCHWEISSEN MIT HOHEM WÄRMEEINTRAG
Title (fr)
PLAQUE D'ACIER ÉPAISSE TRÈS RÉSISTANTE D"EXCELLENTE RÉSISTANCE À BASSE TEMPÉRATURE DANS LA ZONE AFFECTÉE PAR LA TEMPÉRATURE DE SOUDAGE DU FAIT DU SOUDAGE A HAUTE TEMPÉRATURE
Publication
Application
Priority
- JP 2005007109 W 20050406
- JP 2004113278 A 20040407
- JP 2005102041 A 20050331
Abstract (en)
The present invention provides a high-strength thick steel plate having a plate thickness of 50 to 80 mm and a tensile strength of 490 to 570 MPa which is able to realize an excellent HAZ toughness even when welding with a heat input of 20 to 100 kJ/mm is conducted and is characterized by containing, by wt%, 0.03-0.14% of C, 0.30% or less of Si, 0.8-2.0% of Mn, 0.02% or less of P, 0.005% or less of S, 0.8-4.0% of Ni, 0.003-0.040% of Nb, 0.001-0.040% of Al, 0.0010-0.0100% of N, and 0.005-0.030% of Ti, where Ni and Mn satisfy equation [1], and the balance of iron and unavoidable impurities: Ni / Mn ¥ 10 × Ceq - 3 0.36 < Ceq < 0.42 where, Ceq=C+Mn/6+(Cr+Mo+V)/5+(Ni+Cu)/15
IPC 8 full level
B21B 1/38 (2006.01); C22C 38/00 (2006.01); B21B 3/00 (2006.01); C21D 8/02 (2006.01); C22C 38/14 (2006.01); C22C 38/58 (2006.01)
CPC (source: EP KR US)
C22C 38/001 (2013.01 - KR); C22C 38/002 (2013.01 - KR); C22C 38/005 (2013.01 - KR); C22C 38/02 (2013.01 - KR); C22C 38/04 (2013.01 - KR); C22C 38/06 (2013.01 - KR); C22C 38/08 (2013.01 - EP KR US); C22C 38/12 (2013.01 - KR); C22C 38/14 (2013.01 - KR)
Designated contracting state (EPC)
FR GB
DOCDB simple family (publication)
EP 1736562 A1 20061227; EP 1736562 A4 20071010; JP 2005320624 A 20051117; JP 4660250 B2 20110330; KR 100839262 B1 20080617; KR 20060130700 A 20061219; NO 20065095 L 20070103; SG 151274 A1 20090430; TW 200538561 A 20051201; TW I295693 B 20080411; US 2007181223 A1 20070809; WO 2005098068 A1 20051020
DOCDB simple family (application)
EP 05730695 A 20050406; JP 2005007109 W 20050406; JP 2005102041 A 20050331; KR 20067020353 A 20060929; NO 20065095 A 20061103; SG 2009018078 A 20050406; TW 94110988 A 20050407; US 59466005 A 20050406