EP 1737793 A1 20070103 - Use of CMP dispersions for chemo-mechanical polishing of microlelectronic parts
Title (en)
Use of CMP dispersions for chemo-mechanical polishing of microlelectronic parts
Title (de)
Verwendung einer CMP-Dispersion für das chemisch-mechanische Polieren mikroelektronischer Bauteile
Title (fr)
Utilisation d'une dispersion CMP pour le polissage des elements microelectrique
Publication
Application
Priority
- EP 2005003850 W 20050412
- DE 102004020213 A 20040422
Abstract (en)
[origin: WO2005102932A1] The invention relates to a composition in the form of a dispersion or a slurry for chemo-mechanical polishing (CMP) in the production of electronic or micro-electronic components, in particular, semiconductor elements and/or a mechanical component, in particular, a micro-electronic mechanical component or semiconductor element (MEMS), whereby a material is provided with a high ablation rate with a gentle polishing action. The above is achieved, whereby the composition contains titanium oxide particles with approximate formula Ti02 * xH2O * yH2SO4, where the H2O content of the titanium oxide hydrate particles is 4 - 25 wt. %, preferably 2 - 10 wt. %, and the H2S04 content is 0 - 15 wt. %, preferably 0.1 10 wt. %.
IPC 8 full level
C01G 23/053 (2006.01); C01G 23/047 (2006.01); C09C 1/36 (2006.01); C09G 1/02 (2006.01); C09K 3/14 (2006.01); C23F 3/00 (2006.01); C23F 3/03 (2006.01); C23F 3/06 (2006.01); H01L 21/3105 (2006.01); H01L 21/321 (2006.01)
CPC (source: EP US)
C09C 1/3607 (2013.01 - EP US); C09G 1/02 (2013.01 - EP US); C09K 3/1409 (2013.01 - EP US); C09K 3/1463 (2013.01 - EP US); C23F 3/00 (2013.01 - EP US); C23F 3/03 (2013.01 - EP US); C23F 3/06 (2013.01 - EP US); H01L 21/31053 (2013.01 - EP US); H01L 21/3212 (2013.01 - EP US)
Citation (search report)
See references of WO 2005102932A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2005102932 A1 20051103; DE 102004020213 A1 20051124; EP 1737793 A1 20070103; JP 2007534167 A 20071122; TW 200609317 A 20060316; US 2008020578 A1 20080124
DOCDB simple family (application)
EP 2005003850 W 20050412; DE 102004020213 A 20040422; EP 05730307 A 20050412; JP 2007508781 A 20050412; TW 94112719 A 20050421; US 58727806 A 20061023