Global Patent Index - EP 1737991 A1

EP 1737991 A1 20070103 - FREE-CUTTING, LEAD-CONTAINING CU-NI-SN ALLOY AND PRODUCTION METHOD THEREOF

Title (en)

FREE-CUTTING, LEAD-CONTAINING CU-NI-SN ALLOY AND PRODUCTION METHOD THEREOF

Title (de)

BLEIHALTIGE CU-NI-SN-AUTOMATENLEGIERUNG UND HERSTELLUNGSVERFAHREN DAFÜR

Title (fr)

ALLIAGE DECOLLETABLE CU-NI-SN CONTENANT DU PLOMB ET METHODE DE PRODUCTION

Publication

EP 1737991 A1 20070103 (FR)

Application

EP 04725712 A 20040405

Priority

EP 2004050449 W 20040405

Abstract (en)

[origin: WO2005108631A1] The invention relates to alloys based on copper, nickel, tin and lead, which are obtained by means of continuous or semi-continuous casting, static casting into billets, or spray casting into billets and which can undergo spinodal hardening. The machinability index of the inventive alloys is greater than 80 %, in relation to standard ASTM C36000 brass, and can go up to 90 %. According to the invention, the alloy contains between 1 wt.- % and 20 wt.- % Ni, between 1 wt.- % and 20 wt.- % Sn and between 0.1 wt.- % and 4 wt.- % Pb, the remainder comprising essentially Cu and, optionally, up to 10 % of one or more of the following elements, namely Fe, Zn, Mn, and/or up to 5 % of one or more of the following elements, namely Zr, Nb, Cr, Al, Mg.

IPC 8 full level

C22C 9/06 (2006.01); C22C 9/02 (2006.01); C22F 1/08 (2006.01)

CPC (source: EP KR US)

C22C 9/02 (2013.01 - EP US); C22C 9/06 (2013.01 - EP KR US)

Citation (search report)

See references of WO 2005108631A1

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR

DOCDB simple family (publication)

WO 2005108631 A1 20051117; AU 2004319350 A1 20051117; AU 2004319350 B2 20100708; BR PI0418718 A 20070911; CA 2561903 A1 20051117; CN 1961089 A 20070509; EP 1737991 A1 20070103; IL 178448 A0 20070211; IL 178448 A 20110630; JP 2007531824 A 20071108; KR 20070015929 A 20070206; MX PA06011498 A 20070321; NO 20064876 L 20061221; NZ 550305 A 20100730; US 2007089816 A1 20070426

DOCDB simple family (application)

EP 2004050449 W 20040405; AU 2004319350 A 20040405; BR PI0418718 A 20040405; CA 2561903 A 20040405; CN 200480043242 A 20040405; EP 04725712 A 20040405; IL 17844806 A 20061004; JP 2007506666 A 20040405; KR 20067020938 A 20061009; MX PA06011498 A 20040405; NO 20064876 A 20061026; NZ 55030504 A 20040405; US 54250806 A 20061003