EP 1738623 A1 20070103 - METHOD FOR REFLOW SOLDERING
Title (en)
METHOD FOR REFLOW SOLDERING
Title (de)
VERFAHREN ZUM REFLOW-LÖTEN
Title (fr)
PROCEDE DE BRASAGE PAR FUSION
Publication
Application
Priority
- EP 2005003611 W 20050406
- DE 102004017772 A 20040413
Abstract (en)
[origin: WO2005101932A1] The invention relates to a method and device for reflow soldering strip conductors to components and to modules (4), which are attached to a printed circuit board (1) by means of a soldering paste. According to the invention, an absorption material is heated by radiating an electromagnetic wave during which the material absorbs this radiation, and this heating is transferred to the soldering paste for melting a solder contained in the soldering paste. The soldering paste is mixed with the absorption material to form a mixed material (3), and the mixed material is applied to the soldering points of the strip conductors (2).
IPC 8 full level
B23K 1/005 (2006.01); H05K 3/34 (2006.01)
CPC (source: EP US)
B23K 1/0056 (2013.01 - EP US); H05K 3/3485 (2020.08 - EP US); H05K 3/3494 (2013.01 - EP US); B23K 2101/42 (2018.07 - EP US); H05K 2201/0112 (2013.01 - EP US); H05K 2203/111 (2013.01 - EP US)
Citation (search report)
See references of WO 2005101932A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2005101932 A1 20051027; WO 2005101932 B1 20060119; DE 102004017772 A1 20051103; EP 1738623 A1 20070103; MX PA06011768 A 20070321; TW 200533448 A 20051016; US 2007246514 A1 20071025
DOCDB simple family (application)
EP 2005003611 W 20050406; DE 102004017772 A 20040413; EP 05752759 A 20050406; MX PA06011768 A 20050406; TW 94106669 A 20050304; US 57826305 A 20050406