EP 1739162 A1 20070103 - use of compositions for eliminating silicon compounds
Title (en)
use of compositions for eliminating silicon compounds
Title (de)
Verwendung von Zusammensetzungen zur Entfernung von Silikonverbindungen
Title (fr)
usage des compositions pour eliminer des composes de silicone
Publication
Application
Priority
EP 05105954 A 20050630
Abstract (en)
Use of a composition comprising at least one substrate and at least one silicic acid and/or at least one silicate, for removing impurities, preferably silicon compounds from a glass or a glass ceramic surface. Independent claims are included for: (1) a method for gluing two substrates, comprising cleaning the surface of the two substrates by using the composition, applying the adhesive on the surface of the two substrates, contacting the surface of the second substrate with the adhesive, which is located on the first substrates or contacting the surface of the first substrate with the adhesive, which is located on the second substrates, and hardening the adhesive by precipitation; and (2) the composition comprising at least one fiber material and at least one silicic acid and/or at least one silicate.
IPC 8 full level
C11D 3/12 (2006.01); C11D 3/16 (2006.01); C11D 3/43 (2006.01); C11D 7/14 (2006.01); C11D 11/00 (2006.01); C11D 17/04 (2006.01)
CPC (source: EP US)
C11D 7/14 (2013.01 - EP US); C11D 2111/18 (2024.01 - EP US); Y10T 156/10 (2015.01 - EP US)
Citation (search report)
- [XY] US 4124523 A 19781107 - JOHNSON ROBERT D
- [XY] US 6290781 B1 20010918 - BROUILLET JR RICHARD [US]
- [XY] US 6750160 B1 20040615 - HANAOKA KOJI [JP], et al
- [X] DE 10201596 A1 20030731 - NANOGATE TECHNOLOGIES GMBH [DE]
- [Y] DE 3104371 A1 19821111 - HENKEL KGAA [DE]
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA HR LV MK YU
DOCDB simple family (publication)
EP 1739162 A1 20070103; JP 2008545031 A 20081211; US 2009025851 A1 20090129; WO 2007003584 A2 20070111; WO 2007003584 A3 20070802
DOCDB simple family (application)
EP 05105954 A 20050630; EP 2006063710 W 20060630; JP 2008518855 A 20060630; US 92291406 A 20060630