EP 1741010 A4 20110706 - A PROCESS AND APPARATUS FOR IMPROVING AND CONTROLLING THE CURING OF NATURAL AND SYNTHETIC MOLDABLE COMPOUNDS
Title (en)
A PROCESS AND APPARATUS FOR IMPROVING AND CONTROLLING THE CURING OF NATURAL AND SYNTHETIC MOLDABLE COMPOUNDS
Title (de)
PROZESS UND VORRICHTUNG ZUM VERBESSERN UND STEUERN DER AUSHÄRTUNG VON NATÜRLICHEN UND SYNTHETISCHEN FORMBAREN ZUSAMMENSETZUNGEN
Title (fr)
PROCEDE ET APPAREIL POUR AMELIORER ET CONTROLER LA VULCANISATION DE COMPOSES MOULABLES SYNTHETIQUES ET NATURELS
Publication
Application
Priority
- US 2005008254 W 20050311
- US 55248304 P 20040311
- US 80007904 A 20040311
Abstract (en)
[origin: WO2005086965A2] A process for curing a moldable compound under a plurality of curing conditions by: (1) obtaining time dependent data streams of dielectric or impedance values from a plurality of sensors distributed within a curing mold, wherein the moldable compound is a dialectric for each of the sensors; (2) determining impedance related measurements from the data streams for the plurality of sensors; (3) determining predictive and/or corrective curing actions for enhancing the curing process using the impedance related measurements for the plurality of sensors; and (4) controlling the mass production curing of parts to obtain cured parts having one or more desired properties.
IPC 8 full level
G05B 19/18 (2006.01); B29C 35/02 (2006.01); B29C 39/00 (2006.01); B29C 45/00 (2006.01); G01F 7/00 (2006.01); G01F 17/00 (2006.01); G01F 23/00 (2006.01); G01N 27/02 (2006.01); G01N 33/44 (2006.01); G01N 37/00 (2006.01); G04F 1/00 (2006.01); G05B 13/02 (2006.01); G05B 15/02 (2006.01); G06F 19/00 (2011.01); G06G 7/66 (2006.01)
CPC (source: EP)
B29C 35/0288 (2013.01); G01N 27/021 (2013.01); G01N 33/442 (2013.01)
Citation (search report)
- [A] WO 2004004998 A1 20040115 - SIGNATURE CONTROL SYSTEMS INC [US], et al
- See references of WO 2005086965A2
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2005086965 A2 20050922; WO 2005086965 A3 20060727; WO 2005086965 A9 20051117; EP 1741010 A2 20070110; EP 1741010 A4 20110706
DOCDB simple family (application)
US 2005008254 W 20050311; EP 05725438 A 20050311