EP 1741136 A2 20070110 - METHOD FOR PRODUCTION OF ELECTRONIC AND OPTOELECTRONIC CIRCUITS
Title (en)
METHOD FOR PRODUCTION OF ELECTRONIC AND OPTOELECTRONIC CIRCUITS
Title (de)
VERFAHREN ZUR HERSTELLUNG VON ELEKTRONISCHEN UND OPTOELEKTRONISCHEN SCHALTUNGEN
Title (fr)
PROCEDE DE FABRICATION DE CIRCUITS ELECTRONIQUES ET OPTOELECTRONIQUES
Publication
Application
Priority
- FR 2005000881 W 20050412
- FR 0403837 A 20040413
- FR 0410464 A 20041005
- FR 0413629 A 20041221
- FR 0502461 A 20050314
- FR 0503108 A 20050331
Abstract (en)
[origin: WO2005104314A2] The invention relates to an assembly comprising an electronic component (108), said electronic component being connected by microbeads (107) to at least one heat sink (106, 109), said beads being connected to electrically-conducting lines on said electronic component and to electrically-conducting lines on at least one heat sink, said beads transporting electrical signals between the electronic component and each heat sink with said electrically-conducting lines and, by thermal conduction, heat from the electronic component to each heat sink.
IPC 8 full level
H01L 23/367 (2006.01); G02B 6/42 (2006.01); H01L 21/56 (2006.01); H01L 23/36 (2006.01); H01L 23/433 (2006.01); H01S 5/00 (2006.01); H01S 5/02 (2006.01); H01S 5/42 (2006.01); H01S 5/024 (2006.01); H01S 5/183 (2006.01)
CPC (source: EP US)
G02B 6/4202 (2013.01 - EP US); G02B 6/4249 (2013.01 - EP US); H01L 21/563 (2013.01 - EP US); H01L 23/3677 (2013.01 - EP US); H01L 23/4334 (2013.01 - EP US); H01S 5/423 (2013.01 - EP US); G02B 6/4232 (2013.01 - EP US); G02B 6/4246 (2013.01 - EP US); H01L 2224/16 (2013.01 - EP US); H01L 2224/73203 (2013.01 - EP US); H01L 2224/73204 (2013.01 - EP US); H01L 2224/73253 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/01322 (2013.01 - EP US); H01L 2924/1305 (2013.01 - EP US); H01L 2924/15151 (2013.01 - EP US); H01L 2924/16152 (2013.01 - EP US); H01S 5/02251 (2021.01 - EP US); H01S 5/02325 (2021.01 - EP US); H01S 5/0234 (2021.01 - EP US); H01S 5/0237 (2021.01 - EP US); H01S 5/024 (2013.01 - EP US); H01S 5/183 (2013.01 - EP US)
Citation (search report)
See references of WO 2005104314A2
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2005104314 A2 20051103; WO 2005104314 A3 20060302; EP 1741136 A2 20070110; US 2007278666 A1 20071206
DOCDB simple family (application)
FR 2005000881 W 20050412; EP 05757050 A 20050412; US 57830405 A 20050412