EP 1742757 A1 20070117 - DEVICE FOR SEPARATIVE MACHINING OF COMPONENTS MADE FROM BRITTLE MATERIAL WITH STRESS-FREE COMPONENT MOUNTING
Title (en)
DEVICE FOR SEPARATIVE MACHINING OF COMPONENTS MADE FROM BRITTLE MATERIAL WITH STRESS-FREE COMPONENT MOUNTING
Title (de)
VORRICHTUNG ZUM DURCHTRENNENDEN BEARBEITEN VON BAUTEILEN AUS SPRÖDBRÜCHIGEM MATERIAL MIT SPANNUNGSFREIER BAUTEILLAGERUNG
Title (fr)
DISPOSITIF POUR L'USINAGE A L'OUTIL DE COUPE DE COMPOSANTS EN MATERIAU FRAGILE AVEC SUPPORT DE COMPOSANT EXEMPT DE CONTRAINTES
Publication
Application
Priority
- EP 2005003416 W 20050401
- DE 102004020737 A 20040427
Abstract (en)
[origin: WO2005107998A1] The invention relates to a device for the separative machining of components (4), made from brittle material, for example, glass, ceramics, glass ceramics or similar, by generation of a thermally-induced stress fracture on the component at a separation zone. The device comprises a laser for directing a laser beam (10) onto the component for machining, such that the component (4) partly transmits the laser beam with partial absorption at least twice simultaneously or serially along the separating zone essentially at the same point or at points with a small separation. According to the invention, a mounting device, with a bearing surface (40) on which the component for machining may be mounted, is provided in order to reduce or avoid externally-induced mechanical stresses, whereby the bearing surface (40) is at least partly made from a material which is highly transmissive for the laser beam. Said device permits a separative machining of components made from a brittle material with particularly high precision.
IPC 8 full level
B23K 26/40 (2006.01); B28D 1/22 (2006.01); B28D 5/00 (2006.01); B28D 7/04 (2006.01); C03B 33/09 (2006.01)
CPC (source: EP KR US)
B23K 26/40 (2013.01 - EP KR US); B28D 1/221 (2013.01 - EP US); B28D 5/0011 (2013.01 - EP US); B28D 7/04 (2013.01 - EP US); C03B 33/091 (2013.01 - EP US); C03B 33/093 (2013.01 - EP US); B23K 2103/172 (2018.07 - EP US); B23K 2103/50 (2018.07 - EP US)
Citation (search report)
See references of WO 2005107998A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2005107998 A1 20051117; DE 102004020737 A1 20051124; EP 1742757 A1 20070117; JP 2007534499 A 20071129; KR 20070005588 A 20070110; TW 200603929 A 20060201; US 2007039932 A1 20070222
DOCDB simple family (application)
EP 2005003416 W 20050401; DE 102004020737 A 20040427; EP 05729857 A 20050401; JP 2007509907 A 20050401; KR 20067015637 A 20060802; TW 94112767 A 20050421; US 58828606 A 20061027