EP 1743050 A2 20070117 - THERMAL VACUUM DEPOSITION METHOD AND DEVICE
Title (en)
THERMAL VACUUM DEPOSITION METHOD AND DEVICE
Title (de)
VERFAHREN UND VORRICHTUNG ZUR THERMISCHEN VAKUUMBESCHICHTUNG
Title (fr)
PROCEDE ET DISPOSITIF POUR LE REVETEMENT THERMIQUE SOUS VIDE
Publication
Application
Priority
- DE 2005000702 W 20050416
- DE 102004020842 A 20040427
- DE 102004041854 A 20040827
Abstract (en)
[origin: WO2005106072A2] The invention relates to a thermal vacuum deposition device and method in which a band-shaped substrate is continuously conveyed in a vaporization channel that is charged with a vaporous coating material. The aim of the invention is to allow the substrate to be quickly protected against damage during the coating process in previously known deposition methods and devices. Said aim is achieved by the inventive method, which is characterized in that the vaporization channel is sealed by inserting at least one positionally adjustable hollow element into an outer space of the vaporization channel and an inner space of the vaporization channel when a minimum conveying speed is not attained or when the substrate is at a standstill such that the substrate is located in the inner space.
IPC 8 full level
C23C 14/56 (2006.01); C23C 14/24 (2006.01)
CPC (source: EP KR US)
C23C 14/24 (2013.01 - EP KR US); C23C 14/562 (2013.01 - EP KR US); C23C 14/564 (2013.01 - KR)
Citation (search report)
See references of WO 2005106072A2
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2005106072 A2 20051110; WO 2005106072 A3 20060601; CA 2564256 A1 20051110; CN 1950535 A 20070418; CN 1950535 B 20100526; DE 102004041854 A1 20051124; DE 102004041854 B4 20081113; EP 1743050 A2 20070117; JP 2007534843 A 20071129; KR 100835044 B1 20080603; KR 20070005004 A 20070109; US 2007240636 A1 20071018
DOCDB simple family (application)
DE 2005000702 W 20050416; CA 2564256 A 20050416; CN 200580013492 A 20050416; DE 102004041854 A 20040827; EP 05736229 A 20050416; JP 2007509869 A 20050416; KR 20067024898 A 20061127; US 56833205 A 20050416