EP 1743368 A1 20070117 - SAWING AND HANDLER SYSTEM FOR MANUFACTURING SEMICONDUCTOR PACKAGE
Title (en)
SAWING AND HANDLER SYSTEM FOR MANUFACTURING SEMICONDUCTOR PACKAGE
Title (de)
SÄGE- UND HANDHABUNGSSYSTEM FÜR DIE HERSTELLUNG EINES HALBLEITERGEHÄUSES
Title (fr)
SYSTEME DE SCIAGE ET DE TRAITEMENT POUR LA FABRICATION D'UN BOITIER A SEMI-CONDUCTEURS
Publication
Application
Priority
- KR 2004003127 W 20041130
- KR 20040032326 A 20040507
Abstract (en)
[origin: WO2005109492A1] Disclosed is a sawing and handler system for manufacturing a semiconductor package. The system includes an on-loader unit, a sawing machine and a cleaning unit, which are sequentially aligned in the system so that the semiconductor strip or the semiconductor package sequentially passes through the on-loader unit, the sawing machine and the cleaning unit according to a process order thereof, thereby improving the sawing and processing speed of the system for the semiconductor strip.
IPC 8 full level
H01L 21/78 (2006.01); B28D 5/00 (2006.01); H01L 21/00 (2006.01)
CPC (source: EP)
B28D 5/0076 (2013.01); B28D 5/0082 (2013.01); H01L 21/67051 (2013.01); H01L 21/67092 (2013.01); H01L 21/67236 (2013.01)
Designated contracting state (EPC)
DE NL
DOCDB simple family (publication)
WO 2005109492 A1 20051117; CN 100470758 C 20090318; CN 1954423 A 20070425; EP 1743368 A1 20070117; EP 1743368 A4 20090128; HK 1098251 A1 20070713; JP 2007536727 A 20071213
DOCDB simple family (application)
KR 2004003127 W 20041130; CN 200480042980 A 20041130; EP 04821957 A 20041130; HK 07105545 A 20070528; JP 2007511269 A 20041130