EP 1744854 A1 20070124 - METHOD FOR JOINING DISPERSION-STRENGTHENED ALLOY
Title (en)
METHOD FOR JOINING DISPERSION-STRENGTHENED ALLOY
Title (de)
VERFAHREN ZUR VERBINDUNG EINER DISPERSIONSVERFESTIGTEN LEGIERUNG
Title (fr)
PROCEDE DESTINE A ASSEMBLER UN ALLIAGE RENFORCE DE DISPERSION
Publication
Application
Priority
- SE 2005000572 W 20050420
- SE 0401139 A 20040430
Abstract (en)
[origin: WO2005105362A1] The present invention relates to a method for joining two or more components and/or construction parts, at least one of which consists of a dispersion-strengthened alloy having the following composition (in % by weight): C up to 0,08 Si up to 0,7 Cr 10-25 Al 1-10 Mo 1,5-5 Mn up to 0,4 balance Fe as well as normally occurring impurities by the fact that the cross section in the joint is enlarged by forging before joining and where the product manufactured according to the method can be used in high-temperature applications at temperatures above 900 °C.
IPC 8 full level
B23K 31/02 (2006.01); B23K 33/00 (2006.01); C21D 7/13 (2006.01); F16L 13/02 (2006.01); B23K 1/20 (2006.01); B23K 9/23 (2006.01); B23K 11/34 (2006.01); B23K 20/24 (2006.01)
IPC 8 main group level
B23K (2006.01)
CPC (source: EP KR SE US)
B23K 1/20 (2013.01 - KR); B23K 9/23 (2013.01 - KR); B23K 11/34 (2013.01 - KR); B23K 20/24 (2013.01 - KR); B23K 33/006 (2013.01 - SE); C21D 7/13 (2013.01 - EP KR US); C22C 38/02 (2013.01 - EP KR US); C22C 38/04 (2013.01 - EP KR US); C22C 38/06 (2013.01 - EP KR US); C22C 38/22 (2013.01 - EP KR US); B23K 1/20 (2013.01 - EP US); B23K 9/23 (2013.01 - EP US); B23K 11/34 (2013.01 - EP US); B23K 20/24 (2013.01 - EP US); B23K 2101/06 (2018.07 - EP KR US); B23K 2103/04 (2018.07 - EP US); B23K 2103/05 (2018.07 - EP US)
Citation (search report)
See references of WO 2005105362A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2005105362 A1 20051110; CN 1950171 A 20070418; EP 1744854 A1 20070124; JP 2007535409 A 20071206; KR 20070005711 A 20070110; SE 0401139 D0 20040430; SE 0401139 L 20051031; SE 528132 C2 20060912; US 2008141616 A1 20080619
DOCDB simple family (application)
SE 2005000572 W 20050420; CN 200580013702 A 20050420; EP 05736065 A 20050420; JP 2007510651 A 20050420; KR 20067022670 A 20061030; SE 0401139 A 20040430; US 58796707 A 20070904