EP 1748865 B1 20090708 - FILLER FOR JOINT AND METHOD FOR THE PRODUCTION THEREOF
Title (en)
FILLER FOR JOINT AND METHOD FOR THE PRODUCTION THEREOF
Title (de)
ZUSATZWERKSTOFF FÜR FÜGEVERBINDUNGEN UND VERFAHREN ZU DESSEN HERSTELLUNG
Title (fr)
MATERIAU D'APPORT POUR ASSEMBLAGES ET SON PROCEDE DE PRODUCTION
Publication
Application
Priority
- AT 2005000182 W 20050525
- AT 9272004 A 20040527
Abstract (en)
[origin: WO2005115680A1] The invention relates to a filler for thermal production of a joint or a material layer which is metallically connected to the base material of /or on objects made of light metal and/or zinc alloys with a conductivity of more than 110 W/mK, in addition to a method for the production thereof with means for the preparation thereof in situ and/or storage. According to the invention, the filler is provided in the form of an unwindable filler wire, comprising a covering which is optionally provided with a surface coating made of polymer (s) and graphite, consisting of aluminium and/or magnesium and/or zinc or a deformable alloy of said metals with a thermal conductivity of more than 110 W/mK and a core made of compacted powder. The core material consists of metal powder and/or powder of at least one metal compound and/or non-metal compound and/ or agent giving off gas at a high temperature and/or at least one component forming slag. Production is characterized by manufacture of a filling wire known per se, however an optionally coated covering made of a ductile light metal or similar alloy is provided, wherein the coils are wound in a suitable manner and are provided with a protection against moisture.
IPC 8 full level
B23K 35/40 (2006.01); B23K 35/28 (2006.01); B23K 35/365 (2006.01); B23K 35/368 (2006.01)
CPC (source: EP US)
B66C 23/54 (2013.01 - EP US); Y10T 29/49826 (2015.01 - EP US); Y10T 428/12222 (2015.01 - EP US); Y10T 428/2951 (2015.01 - EP US)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2005115680 A1 20051208; AT 500494 A1 20060115; AT 500494 B1 20061215; AT E435716 T1 20090715; DE 502005007660 D1 20090820; EP 1748865 A1 20070207; EP 1748865 B1 20090708; ES 2330236 T3 20091207; JP 2008500186 A 20080110; PL 1748865 T3 20091231; US 2008014458 A1 20080117; US 8704136 B2 20140422
DOCDB simple family (application)
AT 2005000182 W 20050525; AT 05743375 T 20050525; AT 9272004 A 20040527; DE 502005007660 T 20050525; EP 05743375 A 20050525; ES 05743375 T 20050525; JP 2007516868 A 20050525; PL 05743375 T 20050525; US 56954905 A 20050525