EP 1748865 B1 20090708 - FILLER FOR JOINT AND METHOD FOR THE PRODUCTION THEREOF
Title (en)
FILLER FOR JOINT AND METHOD FOR THE PRODUCTION THEREOF
Title (de)
ZUSATZWERKSTOFF FÜR FÜGEVERBINDUNGEN UND VERFAHREN ZU DESSEN HERSTELLUNG
Title (fr)
MATERIAU D'APPORT POUR ASSEMBLAGES ET SON PROCEDE DE PRODUCTION
Publication
Application
Priority
- AT 2005000182 W 20050525
- AT 9272004 A 20040527
Abstract (en)
[origin: US8704136B2] The invention relates to a filler material for a thermal production of a joint or of a material layer metallically connected to the base material of or on objects of light metal and/or zinc alloys with a thermal conductivity of more than 110 W/mK, and to a method for producing the same with means for the preparation thereof in situ and/or storage. To improve the quality of the connection, it is provided according to the invention that the filler material is formed as unwindable filler wire, built up of a sheath optionally provided with a surface layer formed from polymer(s) and graphite and comprising aluminum and/or magnesium and/or zinc or a deformable alloy of these metals with a thermal conductivity of more than 110 W/mK and a core of compacted powder, whereby the core material comprises a metal powder and/or a powder of at least one metal compound and/or a non-metallic compound and/or an agent giving off gas at increased temperature and/or at least one component forming slag. The production is characterized by a filler wire production known per se, but with an optionally coated sheath of a ductile light metal or the like alloy, with a correctly positioned winding on coils and providing the same with a protection against moisture.
IPC 8 full level
B23K 35/40 (2006.01); B23K 35/28 (2006.01); B23K 35/365 (2006.01); B23K 35/368 (2006.01)
CPC (source: EP US)
B66C 23/54 (2013.01 - EP US); Y10T 29/49826 (2015.01 - EP US); Y10T 428/12222 (2015.01 - EP US); Y10T 428/2951 (2015.01 - EP US)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2005115680 A1 20051208; AT 500494 A1 20060115; AT 500494 B1 20061215; AT E435716 T1 20090715; DE 502005007660 D1 20090820; EP 1748865 A1 20070207; EP 1748865 B1 20090708; ES 2330236 T3 20091207; JP 2008500186 A 20080110; PL 1748865 T3 20091231; US 2008014458 A1 20080117; US 8704136 B2 20140422
DOCDB simple family (application)
AT 2005000182 W 20050525; AT 05743375 T 20050525; AT 9272004 A 20040527; DE 502005007660 T 20050525; EP 05743375 A 20050525; ES 05743375 T 20050525; JP 2007516868 A 20050525; PL 05743375 T 20050525; US 56954905 A 20050525