Global Patent Index - EP 1749758 A1

EP 1749758 A1 20070207 - Blister packaging and its method of manufacture

Title (en)

Blister packaging and its method of manufacture

Title (de)

Blisterverpackung sowie Verfahren zu ihrer Herstellung

Title (fr)

Emballage blister et procédé pour sa fabrication

Publication

EP 1749758 A1 20070207 (DE)

Application

EP 05107220 A 20050805

Priority

EP 05107220 A 20050805

Abstract (en)

Blister pack has holding part (8) which has a foil (9). Pressure sensitive adhesive is fixed on the side facing the base (6) for fixing the blister (2). The surface of the foil is coated with pressure sensitive adhesive e.g. self adhesive film. An independent claim is also included for the manufacturing method of the blister pack.

IPC 8 full level

B65D 83/04 (2006.01); B65D 75/30 (2006.01); B65D 75/34 (2006.01)

CPC (source: EP)

B65D 75/30 (2013.01); B65D 75/327 (2013.01); B65D 83/0463 (2013.01)

Citation (applicant)

US 4125190 A 19781114 - DAVIE JR JOHN H, et al

Citation (search report)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

Designated extension state (EPC)

AL BA HR MK YU

DOCDB simple family (publication)

EP 1749758 A1 20070207

DOCDB simple family (application)

EP 05107220 A 20050805