EP 1750883 A1 20070214 - HARD-SOLDERING METHOD AND DEVICE
Title (en)
HARD-SOLDERING METHOD AND DEVICE
Title (de)
VERFAHREN UND VORRICHTUNG ZUM HARTLÖTEN
Title (fr)
PROCEDE ET DISPOSITIF DE BRASAGE
Publication
Application
Priority
- CH 2005000287 W 20050520
- CH 9282004 A 20040601
Abstract (en)
[origin: WO2005118196A1] To hard-solder parts to be joined (2) along a common joint, the parts are heated by a heat source e.g. a laser beam (3). Fused solder (7) that is stored in a container (6) is then introduced into the joint. Joints can be rapidly filled with solder in this manner and the solidified solder surface is practically devoid of pores, thus permitting the priming or painting of said parts without the need for subsequent treatment.
IPC 8 full level
B23K 1/005 (2006.01); B23K 3/03 (2006.01); B23K 3/06 (2006.01)
CPC (source: EP KR US)
B23K 1/00 (2013.01 - KR); B23K 1/005 (2013.01 - KR); B23K 1/0056 (2013.01 - EP US); B23K 3/03 (2013.01 - KR); B23K 3/0353 (2013.01 - EP US); B23K 3/06 (2013.01 - KR); B23K 3/0607 (2013.01 - EP US); B23K 2101/006 (2018.07 - EP US)
Citation (search report)
See references of WO 2005118196A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2005118196 A1 20051215; CN 1984741 A 20070620; EP 1750883 A1 20070214; JP 2008500903 A 20080117; KR 20070030214 A 20070315; US 2008272112 A1 20081106
DOCDB simple family (application)
CH 2005000287 W 20050520; CN 200580024040 A 20050520; EP 05740502 A 20050520; JP 2007513645 A 20050520; KR 20067026022 A 20061211; US 62809305 A 20050520