EP 1752551 A1 20070214 - MOLYBDENUM- BASED ALLOY MATERIAL EXHIBITING HIGH STRENGTH AND HIGH CRYSTALLIZATION TEMPERATURE AND METHOD FOR PRODUCTION THEREOF
Title (en)
MOLYBDENUM- BASED ALLOY MATERIAL EXHIBITING HIGH STRENGTH AND HIGH CRYSTALLIZATION TEMPERATURE AND METHOD FOR PRODUCTION THEREOF
Title (de)
AUF MOLYBDÄN BASIERENDES LEGIERUNGSMATERIAL MIT HOHER FESTIGKEIT UND HOHER REKRISTALLISATIONSTEMPERATUR UND HERSTELLUNGSVERFAHREN DAFÜR
Title (fr)
MATÉRIAU ALLIÉ À BASE DE MOLYBDÈNE ET PRÉSENTANT UNE EXCELLENTE RÉSISTANCE ET UNE TEMPÉRATURE ÉLEVÉE DE RECRISTALLISATION ET PROCÉDÉ DE FABRICATION DE CELUI-CI
Publication
Application
Priority
- JP 2005008069 W 20050427
- JP 2004135752 A 20040430
Abstract (en)
A refractory metal-based alloy material exhibiting high strength and high recrystallization temperature includes a worked material obtained by carburizing, while using a carbon source and coexisted oxygen, a material containing nitride particles of a solute metal dispersed and precipitated in a matrix by multi-step nitriding of a worked alloy material containing one metal selected from Mo, W, and Cr as a matrix and at least one element selected from Ti, Zr, Hf, V, Nb, and Ta as the solute metal, wherein the worked material contains carbon segregated at grain boundaries as a result of the carburizing and oxide particles converted from the nitride particles.
IPC 8 full level
C22C 1/10 (2006.01); C22F 1/18 (2006.01); C22C 27/00 (2006.01); C22C 27/04 (2006.01); C22C 32/00 (2006.01); C22F 1/00 (2006.01); C23C 8/34 (2006.01)
CPC (source: EP KR US)
C22C 1/10 (2013.01 - KR); C22C 1/1078 (2013.01 - EP US); C22C 32/0005 (2013.01 - EP US); C22C 37/04 (2013.01 - KR); C23C 8/34 (2013.01 - EP KR US); B22F 2999/00 (2013.01 - EP US)
C-Set (source: EP US)
Designated contracting state (EPC)
AT DE FR GB NL
DOCDB simple family (publication)
EP 1752551 A1 20070214; EP 1752551 A4 20100915; JP 2005314768 A 20051110; JP 4255877 B2 20090415; KR 100845042 B1 20080708; KR 20070004896 A 20070109; TW 200535254 A 20051101; TW I262953 B 20061001; US 2008017278 A1 20080124; WO 2005106055 A1 20051110
DOCDB simple family (application)
EP 05737380 A 20050427; JP 2004135752 A 20040430; JP 2005008069 W 20050427; KR 20067022235 A 20061025; TW 94114036 A 20050429; US 57914305 A 20050427