EP 1753038 A3 20121121 - Light emitting diode package having recess in heat conducting part
Title (en)
Light emitting diode package having recess in heat conducting part
Title (de)
Leuchtdioden-Verpackung mit einer Ausnehmung in ein wärmeleitendes Element
Title (fr)
Boîtier de diode électroluminescente avec un évidement dans une pièce conductrice de chaleur
Publication
Application
Priority
KR 20050072435 A 20050808
Abstract (en)
[origin: EP1753038A2] The invention provides an LED package including an LED chip. In the LED package, a heat conducting part of folded sheet metals has a recess formed thereon to seat the LED chip therein. A package body houses the heat conducting part and directs light generated from the LED chip upward. Also, a transparent encapsulant is provided to at least the recess of the heat conducting part. Leads are partially housed by the package body to supply power to the LED chip. According to the invention, the sheet metals are folded to form the heat conducting part, and the recess is formed on the heat conducting part to seat the LED chip therein. This improves reflection efficiency and simplifies an overall process.
IPC 8 full level
H01L 33/44 (2010.01); H01L 33/56 (2010.01); H01L 33/62 (2010.01); H01L 33/64 (2010.01); H01L 33/48 (2010.01); H01L 33/60 (2010.01)
CPC (source: EP US)
H01L 24/97 (2013.01 - EP US); H01L 33/647 (2013.01 - EP US); H01L 33/486 (2013.01 - EP US); H01L 33/60 (2013.01 - EP US); H01L 33/62 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/48247 (2013.01 - EP US); H01L 2924/12041 (2013.01 - EP US); H01L 2924/181 (2013.01 - EP US); Y10S 362/80 (2013.01 - EP US)
Citation (search report)
- [X] US 2002163001 A1 20021107 - SHADDOCK DAVID MULFORD [US]
- [X] JP 2002252373 A 20020906 - NICHIA KAGAKU KOGYO KK
- [X] DE 4446566 A1 19960627 - TELEFUNKEN MICROELECTRON [DE]
- [X] WO 0055914 A1 20000921 - GENTEX CORP [US]
- [X] JP 2005116937 A 20050428 - MATSUSHITA ELECTRIC IND CO LTD
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA HR MK RS
DOCDB simple family (publication)
EP 1753038 A2 20070214; EP 1753038 A3 20121121; CN 100428514 C 20081022; CN 1913187 A 20070214; JP 2007049149 A 20070222; JP 2011101053 A 20110519; JP 4758301 B2 20110824; JP 5246893 B2 20130724; KR 100632003 B1 20061009; US 2007030703 A1 20070208; US 8169128 B2 20120501
DOCDB simple family (application)
EP 06254175 A 20060808; CN 200610110688 A 20060808; JP 2006214617 A 20060807; JP 2011024230 A 20110207; KR 20050072435 A 20050808; US 50036106 A 20060808