EP 1753280 A3 20090617 - Printed circuit board/sheathing bond structure
Title (en)
Printed circuit board/sheathing bond structure
Title (de)
Leiterplatten-/ Ummantelungsverbundstruktur
Title (fr)
Structure enveloppant un circuit imprimé
Publication
Application
Priority
US 18363205 A 20050718
Abstract (en)
[origin: EP1753280A2] The invention relates to a printed circuit board/sheathing bond structure with a sheathing enclosing a printed circuit board (11) and comprised of two plastic-half-shells (12, 13) whose edges are closely bonded to each other in order to hermetically seal the printed circuit board (11).
IPC 8 full level
H05K 5/06 (2006.01)
CPC (source: EP US)
H05K 5/063 (2013.01 - EP US); H05K 5/069 (2013.01 - EP US)
Citation (search report)
- [XY] FR 2657490 A1 19910726 - VAPE SA ETS [FR]
- [Y] WO 9418815 A1 19940818 - ERICSSON TELEFON AB L M [SE], et al
- [Y] EP 0278018 A1 19880817 - WEISS HANS
- [Y] JP 2002305386 A 20021018 - SUNX LTD
- [Y] WO 9809489 A1 19980305 - HONEYWELL INC [US]
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA HR MK RS
DOCDB simple family (publication)
EP 1753280 A2 20070214; EP 1753280 A3 20090617; US 2007012481 A1 20070118
DOCDB simple family (application)
EP 06014937 A 20060718; US 18363205 A 20050718