EP 1755792 A1 20070228 - METHOD FOR COATING ELECTRICALLY CONDUCTIVE SUBSTRATES
Title (en)
METHOD FOR COATING ELECTRICALLY CONDUCTIVE SUBSTRATES
Title (de)
VERFAHREN ZUM BESCHICHTEN ELEKTRISCH LEITFÄHIGER SUBSTRATE
Title (fr)
PROCEDE POUR ENDUIRE DES SUBSTRATS ELECTRIQUEMENT CONDUCTEURS
Publication
Application
Priority
- EP 2005052407 W 20050525
- DE 102004027650 A 20040605
Abstract (en)
[origin: WO2005120724A1] The invention relates to a method for coating electrically conductive substrates during which: (1) an electrodeposition paint layer is applied to an electrically conductive substrate and is cured whereby resulting in the formation of an electro-dip coating; afterwards, (2) a layer consisting of a powdery coating material is applied to the electro-dip coating and is cured whereby resulting in the formation of a powder coating, or during which: alternatively, (1) an electrodeposition paint layer is applied to an electrically conductive substrate and, without it being completely cured, is dried; (2) a layer of a powdery coating material is applied to the dried electrodeposition paint layer(s), and; (3) the dried electrodeposition paint layer and the layer of the powdery coating material are cured together whereby resulting in formation of the electro-dip coating and the powder coating. The powdery coating material contains: (A) at least one epoxy resin having a melting point, a melting range or a glass transition temperature of > 30 DEG C; (B) at least one carboxyl group-containing polyester resin, which has a melting point, a melting range or a glass transition temperature of > 30 DEG C, and; (C) at least one polycarboxylic acid with a melting point ranging from 80 to 160 DEG C.
IPC 8 full level
B05D 7/00 (2006.01); C08G 59/42 (2006.01); C09D 5/03 (2006.01); C09D 5/44 (2006.01); B05D 1/00 (2006.01)
CPC (source: EP KR US)
B05D 7/00 (2013.01 - KR); B05D 7/04 (2013.01 - KR); B05D 7/542 (2013.01 - EP US); B05D 7/544 (2013.01 - EP US); C08G 59/42 (2013.01 - EP US); C09D 5/03 (2013.01 - KR); C09D 5/033 (2013.01 - EP US); C09D 5/4488 (2013.01 - EP US); B05D 1/007 (2013.01 - EP US)
Citation (search report)
See references of WO 2005120724A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2005120724 A1 20051222; CN 1964797 A 20070516; DE 102004027650 A1 20060105; EP 1755792 A1 20070228; JP 2008501499 A 20080124; KR 20070040366 A 20070416; US 2007224337 A1 20070927; US 7862851 B2 20110104
DOCDB simple family (application)
EP 2005052407 W 20050525; CN 200580018364 A 20050525; DE 102004027650 A 20040605; EP 05752763 A 20050525; JP 2007513934 A 20050525; KR 20077000102 A 20070103; US 56852305 A 20050525