EP 1756253 A1 20070228 - MATRIX LIQUID FOR PRODUCING A CHIP REMOVAL SUSPENSION, AND USED AS A LUBRICATING OR MACHINING LIQUID
Title (en)
MATRIX LIQUID FOR PRODUCING A CHIP REMOVAL SUSPENSION, AND USED AS A LUBRICATING OR MACHINING LIQUID
Title (de)
MATRIXFLÜSSIGKEIT ZUR HERSTELLUNG EINER ZERSPANUNGSSUSPENSION SOWIE ALS SCHMIER- ODER BEARBEITUNGSFLÜSSIGKEIT
Title (fr)
LIQUIDE MATRICIEL SERVANT A PRODUIRE UNE SUSPENSION D'ENLEVEMENT DE COPEAUX, UTILISE EN TANT QUE LIQUIDE LUBRIFIANT OU LIQUIDE DE TRAITEMENT
Publication
Application
Priority
- EP 2005006271 W 20050610
- DE 102004028785 A 20040616
- DE 102005007368 A 20050217
Abstract (en)
[origin: WO2005123888A1] The invention relates to a matrix liquid for producing chip removal suspensions, a chip removal suspension produced using said matrix liquid, and a method for fractioning the chip removal suspension used. The invention also relates to a homogeneous mixture consisting of a polymer or various polymers and water, that can be especially advantageously used in all technical applications in which lubricating properties are required from a liquid. According to the invention, a mixture of water and a thickening agent or at least one polymer is used as the matrix or lubricating liquid. The cutting grains can be easily and rapidly separated from a used chip removal suspension that has been produced using said matrix liquid, in order to be reused. Less process water is required and the process water can be easily biologically purified, as it does not have to be rid of an alcohol content in a complex manner.
IPC 8 full level
C10M 173/02 (2006.01); B24B 57/00 (2006.01); B28D 1/02 (2006.01); B28D 5/00 (2006.01); C09G 1/02 (2006.01); C09G 1/04 (2006.01); C09K 3/14 (2006.01); C10M 175/00 (2006.01); C10M 175/04 (2006.01)
CPC (source: EP KR US)
C09K 3/14 (2013.01 - KR); C10M 173/02 (2013.01 - EP KR US); C10M 175/00 (2013.01 - EP KR US); C10M 175/0016 (2013.01 - EP US); C10M 175/0058 (2013.01 - EP US); C10M 175/04 (2013.01 - EP KR US); C10M 2209/12 (2013.01 - EP US); C10N 2020/091 (2020.05 - EP US); C10N 2030/02 (2013.01 - EP US); C10N 2030/16 (2013.01 - EP US); C10N 2030/64 (2020.05 - EP US); C10N 2040/08 (2013.01 - EP US); C10N 2040/22 (2013.01 - EP US); C10N 2050/015 (2020.05 - EP US)
Citation (search report)
See references of WO 2005123888A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2005123888 A1 20051229; DE 102005007368 A1 20060105; EP 1756253 A1 20070228; JP 2008502751 A 20080131; JP 5091668 B2 20121205; KR 20070040367 A 20070416; NO 20065430 L 20070116; RU 2007101395 A 20080810; RU 2379334 C2 20100120; TW 200617157 A 20060601; US 2008016783 A1 20080124; US 7591376 B2 20090922
DOCDB simple family (application)
EP 2005006271 W 20050610; DE 102005007368 A 20050217; EP 05754371 A 20050610; JP 2007515840 A 20050610; KR 20077000134 A 20070103; NO 20065430 A 20061127; RU 2007101395 A 20050610; TW 94119895 A 20050615; US 62953905 A 20050610