EP 1756328 A2 20070228 - SYSTEM AND METHOD FOR FORMING MULTI-COMPONENT DIELECTRIC FILMS
Title (en)
SYSTEM AND METHOD FOR FORMING MULTI-COMPONENT DIELECTRIC FILMS
Title (de)
SYSTEM UND VERFAHREN ZUR HERSTELLUNG DIELEKTRISCHER MEHRKOMPONENTENFILME
Title (fr)
SYSTEME ET PROCEDE DE FORMATION DE FILMS DIELECTRIQUES MULTICOMPOSANTS
Publication
Application
Priority
- US 2005021291 W 20050615
- US 86977904 A 20040615
Abstract (en)
[origin: WO2005124849A2] The present invention provides systems and methods for mixing precursors such that a mixture of precursors are present together in a chamber during a single pulse step in an atomic layer deposition (ALD) process to form a multi-component film. The precursors are comprised of at least one different chemical component, and such different components will form a mono-layer to produce a multi-component film. In a further aspect of the present invention, a dielectric film having a composition gradient is provided.
IPC 8 full level
C23C 16/00 (2006.01); C23C 16/02 (2006.01); C23C 16/06 (2006.01); C23C 16/30 (2006.01); C23C 16/34 (2006.01); C23C 16/40 (2006.01); C23C 16/455 (2006.01); H01L 21/314 (2006.01); H01L 21/469 (2006.01); C23C 16/44 (2006.01); H01L 21/316 (2006.01)
CPC (source: EP KR US)
C23C 16/00 (2013.01 - KR); C23C 16/029 (2013.01 - EP); C23C 16/06 (2013.01 - KR); C23C 16/308 (2013.01 - EP); C23C 16/34 (2013.01 - EP); C23C 16/401 (2013.01 - EP); C23C 16/45525 (2013.01 - EP); C23C 16/45529 (2013.01 - EP); C23C 16/45531 (2013.01 - EP); C23C 16/45546 (2013.01 - EP); H01L 21/02148 (2013.01 - EP US); H01L 21/02181 (2013.01 - US); H01L 21/022 (2013.01 - EP); H01L 21/02205 (2013.01 - US); H01L 21/0228 (2013.01 - EP US); H01L 21/02337 (2013.01 - US)
Citation (search report)
See references of WO 2005124849A2
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2005124849 A2 20051229; WO 2005124849 A3 20060406; CN 101014730 A 20070808; EP 1756328 A2 20070228; JP 2008502805 A 20080131; KR 20070037492 A 20070404; TW 200606277 A 20060216
DOCDB simple family (application)
US 2005021291 W 20050615; CN 200580025040 A 20050615; EP 05763357 A 20050615; JP 2007516735 A 20050615; KR 20077001032 A 20070115; TW 94119857 A 20050615