EP 1758154 A4 20091028 - SILICON WAFER MANUFACTURING METHOD AND SILICON WAFER
Title (en)
SILICON WAFER MANUFACTURING METHOD AND SILICON WAFER
Title (de)
SILIZIUMWAFER-HERSTELLUNGSVERFAHREN UND SILIZIUMWAFER
Title (fr)
PROCÉDÉ DE FABRICATION D'UNE PLAQUE DE SILICIUM ET PLAQUE DE SILICIUM
Publication
Application
Priority
- JP 2005010215 W 20050603
- JP 2004176784 A 20040615
Abstract (en)
[origin: EP1758154A1] The present invention is a method for producing a silicon wafer from a silicon single crystal, at least comprising, a double-side polishing step of mirror-polishing both sides of a wafer sliced from the silicon single crystal, a heat treatment step of heat-treating the mirror-polished wafer, and a repolishing step of polishing again a front surface or the both sides of the heat-treated wafer. There is provided a method for producing a silicon wafer by which a silicon wafer of high quality in which COP-free region or oxide precipitate-free region is sufficiently ensured and in which also neither haze nor foreign body sticking is on a wafer front surface and further in which no contact trace with a jig is on a wafer back surface can be produced.
IPC 8 full level
B24B 37/08 (2012.01); C30B 29/06 (2006.01); C30B 33/00 (2006.01); H01L 21/302 (2006.01); H01L 21/304 (2006.01); H01L 21/306 (2006.01); H01L 21/322 (2006.01); H01L 21/324 (2006.01)
CPC (source: EP KR US)
B24B 37/08 (2013.01 - EP US); C30B 29/06 (2013.01 - EP US); C30B 33/00 (2013.01 - EP US); H01L 21/02008 (2013.01 - EP US); H01L 21/304 (2013.01 - KR); H01L 21/3225 (2013.01 - EP US); H01L 21/324 (2013.01 - KR); Y10T 428/21 (2015.01 - EP US)
Citation (search report)
- [XA] WO 0152312 A1 20010719 - MEMC ELECTRONIC MATERIALS [US]
- [Y] US 6548886 B1 20030415 - IKARI ATSUSHI [JP], et al
- [Y] US 6043156 A 20000328 - KAI FUMITAKA [JP], et al
- [Y] US 2003104698 A1 20030605 - TANIGUCHI TORU [JP], et al
- [Y] EP 1326269 A1 20030709 - SHINETSU HANDOTAI KK [JP]
- [Y] JP H09260314 A 19971003 - SHINETSU HANDOTAI KK
- [A] EP 1391921 A1 20040225 - SHINETSU HANDOTAI KK [JP]
- See references of WO 2005124843A1
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
EP 1758154 A1 20070228; EP 1758154 A4 20091028; EP 1758154 B1 20160420; JP 2006004983 A 20060105; JP 4854936 B2 20120118; KR 101155029 B1 20120612; KR 20070023734 A 20070228; US 2007295265 A1 20071227; WO 2005124843 A1 20051229
DOCDB simple family (application)
EP 05745693 A 20050603; JP 2004176784 A 20040615; JP 2005010215 W 20050603; KR 20067026331 A 20050603; US 59751205 A 20050603