EP 1758214 A1 20070228 - Assembly with a power semiconductor module and a connector
Title (en)
Assembly with a power semiconductor module and a connector
Title (de)
Anordnung mit Leistungshalbleitermodul und mit Anschlussverbinder
Title (fr)
Assemblage avec un module semiconducteur de puissance et un connecteur
Publication
Application
Priority
DE 102005039946 A 20050824
Abstract (en)
The arrangement includes a power semiconductor module that has a housing (3), and connectors (6) for load connection and auxiliary connections. Spring contact components are arranged projecting from the housing. The housing is also provided with first connecting units for coupling with the connectors, and second connecting units (62,64) and metal molded portion (7) with contact areas for coming in contact with the spring contact components. The metal molded portion also has contact sections (70) for external connection of the power semiconductor module.
IPC 8 full level
H01R 31/06 (2006.01)
CPC (source: EP)
H01R 31/065 (2013.01)
Citation (applicant)
- DE 102004025609 A1 20051222 - SEMIKRON ELEKTRONIK GMBH [DE]
- DE 10100460 A1 20020718 - SEMIKRON ELEKTRONIK GMBH [DE]
Citation (search report)
- [XY] FR 2763182 A3 19981113 - FORMOSA ELECTRONIC IND INC [TW]
- [Y] US 2002055288 A1 20020509 - PHILIPS ROBERT P [CA], et al
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA HR MK YU
DOCDB simple family (publication)
EP 1758214 A1 20070228; EP 1758214 B1 20071219; AT E381798 T1 20080115; CN 1921110 A 20070228; CN 1921110 B 20101201; DE 102005039946 A1 20070301; DE 502006000232 D1 20080131; DK 1758214 T3 20080407; ES 2299127 T3 20080516; JP 2007059393 A 20070308; JP 4834486 B2 20111214
DOCDB simple family (application)
EP 06017500 A 20060823; AT 06017500 T 20060823; CN 200610121612 A 20060823; DE 102005039946 A 20050824; DE 502006000232 T 20060823; DK 06017500 T 20060823; ES 06017500 T 20060823; JP 2006221518 A 20060815