EP 1759038 A2 20070307 - METHOD FOR SELECTIVE COATING OF A COMPOSITE SURFACE PRODUCTION OF MICROELECTRONIC INTERCONNECTIONS USING SAID METHOD AND INTEGRATED CIRCUITS
Title (en)
METHOD FOR SELECTIVE COATING OF A COMPOSITE SURFACE PRODUCTION OF MICROELECTRONIC INTERCONNECTIONS USING SAID METHOD AND INTEGRATED CIRCUITS
Title (de)
VERFAHREN ZUR SELEKTIVEN BESCHICHTUNG FÜR DIE VERBUNDOBERFLÄCHENHERSTELLUNG VON MIKROELEKTRONISCHEN VERBINDUNGSELEMENTEN UNTER VERWENDUNG BESAGTEN VERFAHRENS UND INTEGRIERTER SCHALTKREISE
Title (fr)
PROCEDE DE REVETEMENT SELECTIF D'UNE SURFACE COMPOSITE, FABRICATION D'INTERCONNEXIONS EN MICROELECTRONIQUE UTILISANT CE PROCEDE, ET CIRCUITS INTEGRES
Publication
Application
Priority
- FR 2005000693 W 20050322
- FR 0403022 A 20040324
Abstract (en)
[origin: WO2005098087A2] The invention relates to a method for selective coating of specific regions of a composite surface with a conducting film, a method for production of microelectronic interconnections, methods and processes for the production of integrated circuits and, more particularly, the formation of networks of metallic interconnections. The invention further relates to methods and processes for the production of microsystems and connectors.
IPC 8 full level
C23C 18/16 (2006.01); B05B 1/34 (2006.01); B05B 11/00 (2006.01); B05B 11/04 (2006.01); C23C 18/30 (2006.01); C23C 18/31 (2006.01); H01L 21/288 (2006.01); H01L 21/768 (2006.01)
CPC (source: EP KR US)
C23C 18/16 (2013.01 - KR); C23C 18/1608 (2013.01 - EP US); C23C 18/1834 (2013.01 - EP US); C23C 18/1844 (2013.01 - EP US); C23C 18/1882 (2013.01 - EP US); C23C 18/1893 (2013.01 - EP US); C23C 18/30 (2013.01 - EP KR US); C23C 18/31 (2013.01 - EP KR US); H01L 21/76849 (2013.01 - EP US); H01L 21/76874 (2013.01 - EP US); C23C 18/32 (2013.01 - EP US); Y10T 29/49155 (2015.01 - EP US)
Citation (search report)
See references of WO 2005098087A2
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
FR 2868085 A1 20050930; FR 2868085 B1 20060714; CA 2560658 A1 20051020; CA 2560658 C 20120821; CN 1946875 A 20070411; CN 1946875 B 20120509; EP 1759038 A2 20070307; IL 178218 A0 20061231; IL 178218 A 20131031; JP 2007530781 A 20071101; JP 4659022 B2 20110330; KR 101180638 B1 20120906; KR 20070053657 A 20070525; TW 200535972 A 20051101; TW I384524 B 20130201; US 2009095507 A1 20090416; US 8298946 B2 20121030; WO 2005098087 A2 20051020; WO 2005098087 A3 20060518
DOCDB simple family (application)
FR 0403022 A 20040324; CA 2560658 A 20050322; CN 200580012883 A 20050322; EP 05743018 A 20050322; FR 2005000693 W 20050322; IL 17821806 A 20060920; JP 2007504448 A 20050322; KR 20067022086 A 20050322; TW 94108769 A 20050322; US 59921405 A 20050322