Global Patent Index - EP 1761118 B1

EP 1761118 B1 20171108 - Wiring board and capacitor

Title (en)

Wiring board and capacitor

Title (de)

Leiterplatte und Kondensator

Title (fr)

Plaque de circuit et condensateur

Publication

EP 1761118 B1 20171108 (EN)

Application

EP 06018351 A 20060901

Priority

  • JP 2005254030 A 20050901
  • JP 2006112262 A 20060414
  • JP 2006168172 A 20060616

Abstract (en)

[origin: EP1761118A1] A wiring board comprising: a board core (11) having a core main surface (12) and a core reverse surface (13); a capacitor (101, 101A, 101B, 101C, IO1D, 101E, 101F, 101G, 101H, 101J, 1101, 1101', 1101", 1101''',1101'''',1101''''') having a capacitor main surface (102) and a capacitor reverse surface (103) and having a structure in which first inner electrode layers (141) and second inner electrode layers (142) are alternately laminated and arranged via a dielectric layer (105), the capacitor (101, 101A, 101B, 101C, 101D, 101E, 101F, 101G; 101H, 101J, 1101, 1101', 1101'', 1101''', 1101'''', 1101 ""') being accommodated in the board core (11) in a state in which the core main surface (12) and the capacitor main surface (102) are oriented on a same side; and a wiring laminated portion (31) having a structure in which interlayer insulating layers (33, 35) and conductor layers (42) are alternately laminated on the core main surface (12) and the capacitor main surface (102), wherein an inductor (251, 252, 253) or a resistor (301, 302, 311, 312, 321, 322) is formed on or in the capacitor (101, 101A, 101B, 101C, 101D, 101E, 101F, 101G, 101H, 101J, 1101, 1101', 1101", 1101"', 1101'''', 1101''''').

IPC 8 full level

H05K 1/18 (2006.01); H01L 23/12 (2006.01)

CPC (source: EP US)

H01G 2/06 (2013.01 - EP US); H01G 4/40 (2013.01 - EP US); H01L 21/568 (2013.01 - EP US); H01L 21/6835 (2013.01 - EP US); H01L 23/49822 (2013.01 - EP US); H01L 23/49838 (2013.01 - EP US); H01L 24/81 (2013.01 - EP US); H05K 1/0233 (2013.01 - EP US); H05K 1/0234 (2013.01 - EP US); H05K 1/185 (2013.01 - EP US); H01L 2221/68345 (2013.01 - EP US); H01L 2224/05568 (2013.01 - EP US); H01L 2224/05573 (2013.01 - EP US); H01L 2224/16225 (2013.01 - EP US); H01L 2224/16235 (2013.01 - EP US); H01L 2224/81192 (2013.01 - EP US); H01L 2224/81801 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H01L 2924/01005 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/01013 (2013.01 - EP US); H01L 2924/01019 (2013.01 - EP US); H01L 2924/01029 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/01038 (2013.01 - EP US); H01L 2924/01042 (2013.01 - EP US); H01L 2924/01047 (2013.01 - EP US); H01L 2924/01056 (2013.01 - EP US); H01L 2924/01074 (2013.01 - EP US); H01L 2924/01078 (2013.01 - EP US); H01L 2924/01082 (2013.01 - EP US); H01L 2924/014 (2013.01 - EP US); H01L 2924/09701 (2013.01 - EP US); H01L 2924/12042 (2013.01 - EP US); H01L 2924/14 (2013.01 - EP US); H01L 2924/15311 (2013.01 - EP US); H01L 2924/19041 (2013.01 - EP US); H01L 2924/19042 (2013.01 - EP US); H01L 2924/19043 (2013.01 - EP US); H01L 2924/30105 (2013.01 - EP US); H01L 2924/30107 (2013.01 - EP US); H01L 2924/351 (2013.01 - EP US); H05K 3/4602 (2013.01 - EP US); H05K 2201/10045 (2013.01 - EP US); H05K 2201/10674 (2013.01 - EP US); H05K 2201/10712 (2013.01 - EP US)

Citation (examination)

Designated contracting state (EPC)

DE FR

DOCDB simple family (publication)

EP 1761118 A1 20070307; EP 1761118 B1 20171108; US 2007076392 A1 20070405; US 7742314 B2 20100622

DOCDB simple family (application)

EP 06018351 A 20060901; US 51303406 A 20060831