EP 1761752 A1 20070314 - TIGHTNESS TEST FOR MEMS OR FOR SMALL ENCAPSULATED COMPONENTS
Title (en)
TIGHTNESS TEST FOR MEMS OR FOR SMALL ENCAPSULATED COMPONENTS
Title (de)
DICHTHEITSPRÜFUNG FÜR MEMS ODER KLEINE VERKAPSELTE KOMPONENTEN
Title (fr)
TEST DE L'ETANCHEITE DE MEMS OU DE PETITS COMPOSANTS ENCAPSULES
Publication
Application
Priority
- FR 2005050523 W 20050629
- FR 0451370 A 20040630
Abstract (en)
[origin: WO2006008412A1] The invention relates to a method for testing the tightness of a MEMS or of a small encapsulated component, the MEMS or small component being mounted in a cavity of a support. Said cavity is closed by sealing means and contains a gas having a density different than that if it were at the pressure of the medium outside of the cavity. The method comprises a step for measuring the density of the gas contained inside the cavity.
IPC 8 full level
G01L 21/12 (2006.01); B81C 99/00 (2010.01); G01M 3/00 (2006.01)
CPC (source: EP US)
G01M 3/002 (2013.01 - EP US); G01M 3/3281 (2013.01 - EP US)
Citation (search report)
See references of WO 2006008412A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
FR 2872572 A1 20060106; FR 2872572 B1 20060922; EP 1761752 A1 20070314; JP 2008504549 A 20080214; US 2007234782 A1 20071011; US 7572053 B2 20090811; WO 2006008412 A1 20060126
DOCDB simple family (application)
FR 0451370 A 20040630; EP 05782184 A 20050629; FR 2005050523 W 20050629; JP 2007518667 A 20050629; US 63047105 A 20050629