EP 1765526 A1 20070328 - COMPOSITIONS AND METHODS FOR DRYING PATTERNED WAFERS DURING MANUFACTURE OF INTEGRATED CIRCUITRY PRODUCTS
Title (en)
COMPOSITIONS AND METHODS FOR DRYING PATTERNED WAFERS DURING MANUFACTURE OF INTEGRATED CIRCUITRY PRODUCTS
Title (de)
ZUSAMMENSETZUNGEN UND VERFAHREN ZUM TROCKNEN VON STRUKTURIERTEN WAFERN BEI DER HERSTELLUNG VON INTEGRIERTEN SCHALTUNGSPRODUKTEN
Title (fr)
COMPOSITIONS ET PROCÉDÉS POUR SÉCHER DES TRANCHES IMPRIMÉES PAR SÉCHAGE DURANT LA FABRICATION DE CIRCUITS IMPRIMÉS
Publication
Application
Priority
US 2004014353 W 20040507
Abstract (en)
[origin: WO2005113167A1] Drying of patterned wafers is achieved in a manner effecting removal of water from the patterned wafers without collapse or deterioration of the pattern structures thereof. The drying is carried out in one aspect of the invention with a composition containing supercritical fluid, and at least one water-reactive agent that chemically reacts with water to form reaction product(s) more soluble in the supercritical fluid than water. Various methodologies are described for use of supercritical fluids to dry patterned wafers, which avoid the (low water solubility) deficiency of supercritical fluids such as supercritical CO2.
IPC 8 full level
B08B 3/00 (2006.01); B08B 3/02 (2006.01); B08B 3/10 (2006.01); B08B 7/00 (2006.01)
CPC (source: EP)
B08B 7/0021 (2013.01)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2005113167 A1 20051201; CN 1960813 A 20070509; EP 1765526 A1 20070328; EP 1765526 A4 20071114; JP 2007536730 A 20071213
DOCDB simple family (application)
US 2004014353 W 20040507; CN 200480043254 A 20040507; EP 04751653 A 20040507; JP 2007511332 A 20040507