EP 1766106 A2 20070328 - PULSE REVERSE ELECTROLYSIS OF ACIDIC COPPER ELECTROPLATING SOLUTIONS
Title (en)
PULSE REVERSE ELECTROLYSIS OF ACIDIC COPPER ELECTROPLATING SOLUTIONS
Title (de)
PULSUMKEHRELEKTROLYSE VON SAUREN KUPFERGALVANISIERUNGSLÖSUNGEN
Title (fr)
ELECTROLYSE A IMPULSIONS INVERSEES DE SOLUTIONS ACIDES DE GALVANOPLASTIE DU CUIVRE
Publication
Application
Priority
- US 2005008502 W 20050315
- US 87679504 A 20040625
Abstract (en)
[origin: US2005284766A1] Pulse reverse electrolysis of acid copper solutions is used for applying copper to printing cylinders, especially gravure printing cylinders. The plating composition generally comprising copper ions, counter ions, chloride ions, a polyalkylene glycol, and a bath-soluble divalent sulfur compound. The benefits include an improved thickness distribution of the copper electrodeposited on the plated article, reduced metal waste, reduced plating times and increased production capacity.
IPC 8 full level
C25D 7/04 (2006.01); C25D 3/38 (2006.01); C25D 5/18 (2006.01)
CPC (source: EP US)
C25D 3/38 (2013.01 - EP US); C25D 5/18 (2013.01 - EP US); C25D 5/627 (2020.08 - EP US)
Designated contracting state (EPC)
DE ES FR GB IT
Designated extension state (EPC)
AL BA HR LV MK YU
DOCDB simple family (publication)
US 2005284766 A1 20051229; CN 101044269 A 20070926; EP 1766106 A2 20070328; EP 1766106 A4 20070905; JP 2008504435 A 20080214; US 2009223827 A1 20090910; WO 2006011922 A2 20060202; WO 2006011922 A3 20070222
DOCDB simple family (application)
US 87679504 A 20040625; CN 200580020350 A 20050315; EP 05725574 A 20050315; JP 2007518029 A 20050315; US 2005008502 W 20050315; US 46976009 A 20090521