EP 1766106 A4 20070905 - PULSE REVERSE ELECTROLYSIS OF ACIDIC COPPER ELECTROPLATING SOLUTIONS
Title (en)
PULSE REVERSE ELECTROLYSIS OF ACIDIC COPPER ELECTROPLATING SOLUTIONS
Title (de)
PULSUMKEHRELEKTROLYSE VON SAUREN KUPFERGALVANISIERUNGSLÖSUNGEN
Title (fr)
ELECTROLYSE A IMPULSIONS INVERSEES DE SOLUTIONS ACIDES DE GALVANOPLASTIE DU CUIVRE
Publication
Application
Priority
- US 2005008502 W 20050315
- US 87679504 A 20040625
Abstract (en)
[origin: US2005284766A1] Pulse reverse electrolysis of acid copper solutions is used for applying copper to printing cylinders, especially gravure printing cylinders. The plating composition generally comprising copper ions, counter ions, chloride ions, a polyalkylene glycol, and a bath-soluble divalent sulfur compound. The benefits include an improved thickness distribution of the copper electrodeposited on the plated article, reduced metal waste, reduced plating times and increased production capacity.
IPC 8 full level
C25D 7/04 (2006.01); C25D 3/38 (2006.01); C25D 5/18 (2006.01)
CPC (source: EP US)
C25D 3/38 (2013.01 - EP US); C25D 5/18 (2013.01 - EP US); C25D 5/627 (2020.08 - EP US)
Citation (search report)
- [Y] DD 264030 A1 19890118 - LEIPZIG GALVANOTECHNIK [DD]
- [Y] US 3923610 A 19751202 - BERGIN MICHAEL J, et al
- See references of WO 2006011922A2
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA HR LV MK YU
DOCDB simple family (publication)
US 2005284766 A1 20051229; CN 101044269 A 20070926; EP 1766106 A2 20070328; EP 1766106 A4 20070905; JP 2008504435 A 20080214; US 2009223827 A1 20090910; WO 2006011922 A2 20060202; WO 2006011922 A3 20070222
DOCDB simple family (application)
US 87679504 A 20040625; CN 200580020350 A 20050315; EP 05725574 A 20050315; JP 2007518029 A 20050315; US 2005008502 W 20050315; US 46976009 A 20090521