Global Patent Index - EP 1766682 A2

EP 1766682 A2 20070328 - IMPROVED COOLING DEVICES FOR DIFFERENT APPLICATIONS

Title (en)

IMPROVED COOLING DEVICES FOR DIFFERENT APPLICATIONS

Title (de)

VERBESSERTE KÜHLVORRICHTUNGEN FÜR VERSCHIEDENE ANWENDUNGEN

Title (fr)

DISPOSITIFS DE REFROIDISSEMENT PERFECTIONNES POUR APPLICATIONS DIVERSES

Publication

EP 1766682 A2 20070328 (FR)

Application

EP 05778868 A 20050623

Priority

  • FR 2005001586 W 20050623
  • FR 0406911 A 20040624
  • FR 0411122 A 20041020
  • FR 0413932 A 20041227

Abstract (en)

[origin: WO2006010822A2] The figure displays the diagram of a laminar flow water cooler (110) for a microprocessor comprising an integral radiator (112) provided with thin-walled and hollow fins which are produced by controlled compression of double convex bellows of a polymer or glass hot-blown blank. In order to form a closed circuit filled with water at the atmospheric pressure, the manifolds (113, 114, 115) of the radiator (112) are connected to the manifolds of an original component (114) formed by a mini heater (116) provided with a copper heating plate with internal grooved face and a mini pump (118) provided with a brushless electric motor devoid of a centrifugal turbine, wherein said mini heater and mini pump are disposed in a rigid small-sized moulded polymer hose. The total thermal resistance of said cooler can be equal to 0.15°/W that is of interest, in particular for high performance microprocessors for dissipating more than 200 W through the very hot central area of 1.5 cm<sup

IPC 8 full level

H01L 23/427 (2006.01); F01P 7/16 (2006.01); F02M 25/07 (2006.01)

CPC (source: EP US)

F01P 3/20 (2013.01 - EP US); F02M 26/22 (2016.02 - EP US); F28D 15/0266 (2013.01 - EP US); F28F 21/06 (2013.01 - EP US); G06F 1/20 (2013.01 - EP US); H01L 23/427 (2013.01 - EP US); H01L 23/473 (2013.01 - EP US); F01P 2005/125 (2013.01 - EP US); F01P 2050/30 (2013.01 - EP US); F01P 2060/02 (2013.01 - EP US); F28D 2021/0031 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US)

C-Set (source: EP US)

H01L 2924/0002 + H01L 2924/00

Citation (search report)

See references of WO 2006010822A2

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR

DOCDB simple family (publication)

WO 2006010822 A2 20060202; WO 2006010822 A3 20060511; WO 2006010822 B1 20060713; EP 1766682 A2 20070328; US 2007184320 A1 20070809

DOCDB simple family (application)

FR 2005001586 W 20050623; EP 05778868 A 20050623; US 57121005 A 20050623