EP 1766726 A1 20070328 - FLEXIBLE RING INTERCONNECTION SYSTEM
Title (en)
FLEXIBLE RING INTERCONNECTION SYSTEM
Title (de)
FLEXIBLES RINGVERBINDUNGSSYSTEM
Title (fr)
SYSTEME D'INTERCONNEXION A BAGUES FLEXIBLES
Publication
Application
Priority
- US 2005018941 W 20050527
- US 57534704 P 20040528
- US 57534804 P 20040528
Abstract (en)
[origin: US2005266703A1] Multiple small conductive and flexible hollow rings, each of which is made from a pliable material, provide a flexible connection medium for use between a substrate and a microelectronic device package. Each ring is soldered to both the substrate and the device and held in place during manufacture by way of a flexible non-conductive film in which H-shaped cutouts are formed and into which a conductive ring is inserted. The interior sections of the H-shaped cutouts extend into the conductive rings and hold the rings in place during manufacture. A portion of the sidewall of each ring is not soldered thus insuring that at least part of the ring stays flexible. The rings accommodate elevation differences on a substrate and electronic device package. They also provide a vibration resistant and flexible joint.
IPC 8 full level
H01R 4/02 (2006.01); H01R 12/00 (2006.01); H01R 13/24 (2006.01); H05K 3/34 (2006.01); H05K 3/30 (2006.01)
CPC (source: EP US)
H01R 4/028 (2013.01 - EP US); H01R 12/52 (2013.01 - EP US); H01R 12/714 (2013.01 - EP US); H01R 13/2414 (2013.01 - EP US); H05K 3/3436 (2013.01 - EP US); H01R 12/57 (2013.01 - EP US); H01R 13/24 (2013.01 - EP US); H05K 3/305 (2013.01 - EP US); H05K 2201/0133 (2013.01 - EP US); H05K 2201/0311 (2013.01 - EP US); H05K 2201/10242 (2013.01 - EP US); H05K 2201/10257 (2013.01 - EP US); H05K 2201/10378 (2013.01 - EP US); H05K 2201/10424 (2013.01 - EP US); H05K 2201/10977 (2013.01 - EP US); H05K 2201/2081 (2013.01 - EP US); Y02P 70/50 (2015.11 - EP US)
Citation (search report)
See references of WO 2005119848A1
Designated contracting state (EPC)
DE FR GB IE NL
DOCDB simple family (publication)
US 2005266703 A1 20051201; US 7189079 B2 20070313; EP 1766726 A1 20070328; US 2005266702 A1 20051201; US 2007123067 A1 20070531; US 7229291 B2 20070612; US 7273380 B2 20070925; WO 2005119848 A1 20051215; WO 2005119848 B1 20060126; WO 2005119850 A1 20051215
DOCDB simple family (application)
US 14019505 A 20050527; EP 05754814 A 20050527; US 13984605 A 20050527; US 2005018941 W 20050527; US 2005018948 W 20050527; US 65799507 A 20070125