Global Patent Index - EP 1769100 A1

EP 1769100 A1 20070404 - DLC HARD MATERIAL COATINGS ON BEARING MATERIALS CONTAINING COPPER

Title (en)

DLC HARD MATERIAL COATINGS ON BEARING MATERIALS CONTAINING COPPER

Title (de)

DLC HARTSTOFFBESCHICHTUNGEN AUF KUPFERHALTIGEN LAGERWERKSTOFFEN

Title (fr)

REVETEMENT EN UN MATERIAU DUR DLC SUR DES MATERIAUX A TENEUR EN CUIVRE POUR PALIERS

Publication

EP 1769100 A1 20070404 (DE)

Application

EP 05731502 A 20050422

Priority

  • CH 2005000225 W 20050422
  • CH 7512004 A 20040429
  • CH 8972004 A 20040525

Abstract (en)

[origin: WO2005106065A1] Disclosed is a bearing material that is made of copper or a copper-containing alloy and is used in plain bearings comprising a coating which is deposited at least on some portions of the sliding surface and is composed at least of a supporting layer and a sliding layer. The sliding layer is embodied as a hard layer containing diamond-type carbon.

IPC 8 full level

C23C 14/00 (2006.01); C23C 14/02 (2006.01); C23C 14/06 (2006.01); C23C 14/14 (2006.01); C23C 16/00 (2006.01); C23C 16/02 (2006.01); C23C 16/26 (2006.01); C23C 28/00 (2006.01); F16C 33/00 (2006.01); F16C 33/04 (2006.01); F16C 33/12 (2006.01); F16C 33/14 (2006.01)

CPC (source: EP US)

C23C 16/0272 (2013.01 - EP US); C23C 16/26 (2013.01 - EP US); C23C 28/042 (2013.01 - EP US); C23C 28/044 (2013.01 - EP US); C23C 28/046 (2013.01 - EP US); C23C 28/048 (2013.01 - EP US); C23C 28/322 (2013.01 - EP US); C23C 28/34 (2013.01 - EP US); C23C 28/341 (2013.01 - EP US); C23C 28/343 (2013.01 - EP US); C23C 28/345 (2013.01 - EP US); C23C 28/3455 (2013.01 - EP US); C23C 28/347 (2013.01 - EP US); C23C 28/36 (2013.01 - EP US); F16C 33/04 (2013.01 - EP US); F16C 2206/04 (2013.01 - EP US)

Citation (search report)

See references of WO 2005106065A1

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR

DOCDB simple family (publication)

WO 2005106065 A1 20051110; EP 1769100 A1 20070404; JP 2007534904 A 20071129; JP 4805255 B2 20111102; US 2005242156 A1 20051103

DOCDB simple family (application)

CH 2005000225 W 20050422; EP 05731502 A 20050422; JP 2007509847 A 20050422; US 11545705 A 20050427