EP 1771596 A1 20070411 - CONDUCTIVE MATERIAL COMPRISING AN Me-DLC HARD MATERIAL COATING
Title (en)
CONDUCTIVE MATERIAL COMPRISING AN Me-DLC HARD MATERIAL COATING
Title (de)
KUPFERHATLTIGER LEITWERKSTOFF MIT Me-DLC HARTSTOFFBESCHICHTUNG
Title (fr)
MATERIAU CONDUCTEUR A BASE DE CUIVRE PRESENTANT UN REVETEMENT EN MATERIAU DUR Me-DLC
Publication
Application
Priority
- CH 2005000333 W 20050615
- CH 11662004 A 20040709
Abstract (en)
[origin: WO2006005200A1] The invention relates to a conductive material consisting of an alloy that contains copper, for use as a plug-in or clip connection. Said material comprises a cover layer that is deposited on at least some sections of the contact surface, said layer consisting at least of a support layer and an adhesive layer. The anti-friction layer has a carbon content greater or less than 40 and less than or equal to 70 atomic percent.
IPC 8 full level
C23C 16/26 (2006.01); C23C 16/02 (2006.01); H01H 1/02 (2006.01)
CPC (source: EP KR US)
C23C 16/0272 (2013.01 - EP US); C23C 16/029 (2013.01 - EP US); C23C 16/26 (2013.01 - EP US); H01B 1/02 (2013.01 - KR); Y10T 428/265 (2015.01 - EP US); Y10T 428/30 (2015.01 - EP US)
Citation (search report)
See references of WO 2006005200A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2006005200 A1 20060119; BR PI0513139 A 20080429; CN 101001976 A 20070718; CN 101001976 B 20101229; EP 1771596 A1 20070411; JP 2008506036 A 20080228; JP 5133057 B2 20130130; KR 101256231 B1 20130417; KR 20070046820 A 20070503; US 2008075625 A1 20080327; US 7771822 B2 20100810
DOCDB simple family (application)
CH 2005000333 W 20050615; BR PI0513139 A 20050615; CN 200580023122 A 20050615; EP 05747049 A 20050615; JP 2007519589 A 20050615; KR 20077001541 A 20050615; US 57177105 A 20050615