EP 1772901 B1 20120725 - Wafer holding article and method for semiconductor processing
Title (en)
Wafer holding article and method for semiconductor processing
Title (de)
Waferhalter und Verfahren zur Halbleiterverarbeitung
Title (fr)
Dispositif support de plaquette semiconductrice et méthode de traitement de semi-conducteurs
Publication
Application
Priority
US 72497005 P 20051007
Abstract (en)
[origin: EP1772901A2] The present invention is directed to semiconductor wafer processing to provide semiconductor wafers having reduced defects. More specifically, the present invention is directed to semiconductor wafer processing to provide semicondutor wafers having reduced defects processed in wafer holding articles with reduced surface roughness.
IPC 8 full level
H01L 21/687 (2006.01)
CPC (source: EP KR US)
C23C 16/345 (2013.01 - EP US); C23C 16/4581 (2013.01 - EP US); C30B 25/12 (2013.01 - EP US); H01L 21/283 (2013.01 - KR); H01L 21/67306 (2013.01 - EP US); H01L 21/67309 (2013.01 - EP US); H01L 21/68735 (2013.01 - EP US); H01L 21/68757 (2013.01 - EP US); H01L 21/68785 (2013.01 - EP US)
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
EP 1772901 A2 20070411; EP 1772901 A3 20090401; EP 1772901 B1 20120725; CN 1953154 A 20070425; JP 2007134688 A 20070531; JP 5183053 B2 20130417; KR 101264395 B1 20130514; KR 20070038935 A 20070411; TW 200729390 A 20070801; TW I327761 B 20100721; US 2007084827 A1 20070419; US 2009194022 A1 20090806; US 7722441 B2 20100525; US 9490157 B2 20161108
DOCDB simple family (application)
EP 06255157 A 20061005; CN 200610131768 A 20061008; JP 2006274839 A 20061006; KR 20060098173 A 20061009; TW 95137130 A 20061005; US 38401509 A 20090331; US 54422306 A 20061006