Global Patent Index - EP 1776709 B1

EP 1776709 B1 20140625 - INDUCTIVE COMPONENT FOR HIGH CURRENTS AND METHOD FOR THE PRODUCTION THEREOF

Title (en)

INDUCTIVE COMPONENT FOR HIGH CURRENTS AND METHOD FOR THE PRODUCTION THEREOF

Title (de)

INDUKTIVES BAUELEMENT FÜR HOHE STRÖME UND VERFAHREN ZU DESSEN HERSTELLUNG

Title (fr)

COMPOSANT INDUCTIF POUR COURANTS ELEVES ET PROCEDE DE PRODUCTION DE CE COMPOSANT

Publication

EP 1776709 B1 20140625 (DE)

Application

EP 05774087 A 20050811

Priority

  • DE 2005001422 W 20050811
  • DE 102004039230 A 20040812

Abstract (en)

[origin: WO2006015589A1] The invention relates to an inductive component which is suitable for high currents, said component comprising a closed magnetic core (3) and a conductor (1) which is difficult to bend and which passes at least twice through the inside of the magnetic core (3). The conductor (1) is, preferably, composed of several parts (11, 12) which can be, respectively, introduced in an easy manner through the inner hole of the magnetic core (3). The parts (11, 12) of the conductor are mechanically connected together in a fixed manner after introduction, and the connecting point is on the outside of the inner chamber of the magnetic core (3). The advantage of said invention is that said inductive component, which is configured for high currents, can achieve high inductively values with a low construction volume.

IPC 8 full level

H01F 27/30 (2006.01); H01F 37/00 (2006.01)

CPC (source: EP US)

H01F 27/303 (2013.01 - EP US); H01F 37/00 (2013.01 - EP US); H01F 27/2847 (2013.01 - EP US); H01F 27/2895 (2013.01 - EP US); Y10T 29/4902 (2015.01 - EP US); Y10T 29/49073 (2015.01 - EP US)

Designated contracting state (EPC)

AT CH DE FR GB LI

DOCDB simple family (publication)

DE 102004039230 A1 20060223; CN 1993782 A 20070704; CN 1993782 B 20110511; EP 1776709 A1 20070425; EP 1776709 B1 20140625; EP 2458598 A1 20120530; EP 2458598 B1 20170927; JP 2008509568 A 20080327; US 2008012675 A1 20080117; US 8063728 B2 20111122; WO 2006015589 A1 20060216

DOCDB simple family (application)

DE 102004039230 A 20040812; CN 200580026778 A 20050811; DE 2005001422 W 20050811; EP 05774087 A 20050811; EP 12153862 A 20050811; JP 2007525164 A 20050811; US 57361605 A 20050811