EP 1779200 A1 20070502 - SURFACE MICROSTRUCTURING DEVICE
Title (en)
SURFACE MICROSTRUCTURING DEVICE
Title (de)
VORRICHTUNG ZUR OBERFLÄCHENMIKROSTRUKTIERUNG
Title (fr)
DISPOSITIF DE MICROSTRUCTURATION DE SURFACE
Publication
Application
Priority
- FR 2005001680 W 20050701
- FR 0407426 A 20040705
Abstract (en)
[origin: WO2006013257A1] The invention concerns a device for microstructuring the surface of at least one substrate characterized in that it comprises a support frame (2) including at least means (6) for conveying the substrate (S) comprising preferably means (15) for supporting the substrate adapted to maintain the substrate in or relative to each of the modules so as to avoid any change of support when the substrate is shifted from one module to the other, a module for applying a photosensitive resin layer on the substrate, a module (20) for automatic exposure using a laser beam of the resin layer on the substrate based on a programmed scheme, a so-called developing module for removing the part of the resin layer which has been exposed of the part or the resin layer which has not been exposed, a module for chemically etching the substrate, a module for cleaning the substrate, and a control unit (7).
IPC 8 full level
G03F 7/20 (2006.01); G03F 7/16 (2006.01); G03F 7/30 (2006.01); H01L 21/00 (2006.01)
CPC (source: EP US)
G03F 7/162 (2013.01 - EP US); G03F 7/3021 (2013.01 - EP US); G03F 7/70991 (2013.01 - EP US); H01L 21/67155 (2013.01 - EP US)
Citation (search report)
See references of WO 2006013257A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
FR 2872502 A1 20060106; FR 2872502 B1 20061110; CA 2572725 A1 20060209; EP 1779200 A1 20070502; JP 2008506145 A 20080228; US 2008149272 A1 20080626; WO 2006013257 A1 20060209
DOCDB simple family (application)
FR 0407426 A 20040705; CA 2572725 A 20050701; EP 05783993 A 20050701; FR 2005001680 W 20050701; JP 2007519831 A 20050701; US 63131105 A 20050701