EP 1781841 A1 20070509 - SURFACE COMPRISING A MICROSTRUCTURE THAT REDUCES ADHESION AND ASSOCIATED PRODUCTION METHOD
Title (en)
SURFACE COMPRISING A MICROSTRUCTURE THAT REDUCES ADHESION AND ASSOCIATED PRODUCTION METHOD
Title (de)
OBERFLÄCHE MIT EINER HAFTUNGSVERMINDERNDEN MIKROSTRUKTUR UND VERFAHREN ZU DEREN HERSTELLUNG
Title (fr)
SURFACE A MICROSTRUCTURE DIMINUANT L'ADHERENCE ET PROCEDE DE FABRICATION ASSOCIE
Publication
Application
Priority
- EP 2005053902 W 20050808
- DE 102004041813 A 20040826
Abstract (en)
[origin: WO2006021507A1] The invention relates to a surface comprising a microstructure that reduces adhesion and to a method for producing said microstructure. Microstructures of this type that reduce adhesion are known and are used, for example, to configure self-cleaning surfaces that use the Lotus effect. According to the invention, the surface is produced electrochemically by means of reverse pulse plating, the known microstructure being first produced and a nanostructure that is overlaid on the microstructure is produced at the same time or in a subsequent step. To achieve this for example, the pulse length of the current pulse that is used during the reverse pulse plating lies in the millisecond range and has a pulse length ratio greater than 1:3 (anodic:cathodic). The microstructure that has been produced, consisting of peaks (19) and troughs (20) is then overlaid with peaks (19n) and troughs (20n) of a smaller size order belonging to the nanostructure, thus permitting the Lotus effect that is achieved by the surface to be greatly improved.
IPC 8 full level
C25D 5/18 (2006.01)
CPC (source: EP US)
C25D 5/18 (2013.01 - EP US); C25D 5/605 (2020.08 - EP US)
Citation (search report)
See references of WO 2006021507A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
DE 102004041813 A1 20060302; BR PI0514625 A 20080617; CN 101048537 A 20071003; CN 101048537 B 20100616; EP 1781841 A1 20070509; US 2008217180 A1 20080911; WO 2006021507 A1 20060302
DOCDB simple family (application)
DE 102004041813 A 20040826; BR PI0514625 A 20050808; CN 200580036799 A 20050808; EP 05787076 A 20050808; EP 2005053902 W 20050808; US 66081405 A 20050808