EP 1785510 A1 20070516 - Electrodeposition medium
Title (en)
Electrodeposition medium
Title (de)
Mittel zur Elektrobeschichtung
Title (fr)
Milieu d'électrodéposition
Publication
Application
Priority
- EP 03076855 A 19980130
- EP 98902738 A 19980130
- US 3602497 P 19970131
- US 4544697 P 19970502
- US 1625098 A 19980130
Abstract (en)
The present invention relates to a cathodic electrodeposition medium for forming a deposit on the surface of a metallic or conductive surface. The medium comprises a combination of water, silica and at least one water soluble silicate. The medium has a basic pH. The resulting deposit imparts improved corrosion resistance to the underlying substrate. In the preferred embodiment, the medium comprises sodium silicate and has a pH of greater than approximately 10.
IPC 8 full level
C25D 9/04 (2006.01); C23C 28/00 (2006.01)
CPC (source: EP)
C23C 28/04 (2013.01); C23C 28/324 (2013.01); C25D 9/04 (2013.01)
Citation (applicant)
- US 3658662 A 19720425 - CASSON EDWARD A JR, et al
- GB 498485 A 19390109 - ROBERT WALTON BUZZARD
- US 5352342 A 19941004 - RIFFE WILLIAM J [US]
Citation (search report)
- [XY] EP 0608107 A2 19940727 - NIPPON PAINT CO LTD [JP]
- [Y] GB 2027055 A 19800213 - NIPPON STEEL CORP
- [X] US 3658662 A 19720425 - CASSON EDWARD A JR, et al
- [X] US 4450209 A 19840522 - HARA TOMIHIRO [JP], et al
- [X] US 4792358 A 19881220 - KIMURA TOSHIRO [JP], et al
- [X] US 5134039 A 19920728 - ALEXANDER GUY B [US], et al
- [X] US 5352277 A 19941004 - SASAKI SHIGEO [JP]
- [X] PATENT ABSTRACTS OF JAPAN vol. 006, no. 090 (C - 104) 27 May 1982 (1982-05-27)
Designated contracting state (EPC)
AT BE CH DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
DOCDB simple family (application)
EP 06115485 A 19980130