Global Patent Index - EP 1786004 A2

EP 1786004 A2 20070516 - Method of manufacturing an electronic component comprising an integrated circuit and a winding assembly

Title (en)

Method of manufacturing an electronic component comprising an integrated circuit and a winding assembly

Title (de)

Herstellungsmethode für ein einen integrierten Schaltkreis und eine Wicklungsanordnung enthaltendes elektronisches Bauteil

Title (fr)

Procédé de fabrication d'un composant électronique comportant un circuit intégré et un ensemble d'enroulement

Publication

EP 1786004 A2 20070516 (EN)

Application

EP 06122211 A 20061012

Priority

  • EP 05110652 A 20051111
  • EP 06122211 A 20061012

Abstract (en)

A method of manufacturing an electronic component comprising an integrated circuit (1) and a core (2), includes the steps of providing the integrated circuit having at least two accessible contacts (12,14), providing the core, assembling the integrated circuit and the core together by means of an adhesive substance (4), winding a wire (30) on the core in order to produce a winding (3), bonding or soldering a first end (31) of the wire to a first one of said contacts and bonding or soldering a second end (32) of the wire to a second one of said contacts.

IPC 8 full level

H01F 27/40 (2006.01); H01F 41/06 (2006.01)

CPC (source: EP)

H01F 27/40 (2013.01); H01F 41/076 (2016.01); H01F 17/045 (2013.01)

Citation (applicant)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

Designated extension state (EPC)

AL BA HR MK RS

DOCDB simple family (publication)

EP 1786004 A2 20070516; EP 1786004 A3 20120711; EP 1786004 B1 20150520

DOCDB simple family (application)

EP 06122211 A 20061012