EP 1787326 A1 20070523 - COOLED INTEGRATED CIRCUIT
Title (en)
COOLED INTEGRATED CIRCUIT
Title (de)
GEKÜHLTE INTEGRIERTE SCHALTUNG
Title (fr)
CIRCUIT INTEGRE REFROIDI
Publication
Application
Priority
DE 2004001577 W 20040720
Abstract (en)
[origin: WO2006007803A1] The invention relates to an integrated circuit (1) having a plurality of substrate layers (2), active and/or passive components (3) embedded in the substrate layers (2), high-frequency lines conducted to the components (3) through the substrate layers (2), and cooling channels (6) for the dissipation of heat. The inventive circuit is characterized in that the cooling channels (6) are configured as high-frequency lines.
IPC 8 full level
H01L 23/473 (2006.01); H01L 23/66 (2006.01); H01P 1/30 (2006.01); H01P 3/06 (2006.01); H01P 3/08 (2006.01); H01P 3/12 (2006.01); H05K 1/00 (2006.01); H05K 1/02 (2006.01)
CPC (source: EP US)
H01L 23/473 (2013.01 - EP US); H01L 23/66 (2013.01 - EP US); H05K 1/024 (2013.01 - EP US); H05K 1/0272 (2013.01 - EP US); H01L 24/48 (2013.01 - EP US); H01L 2224/16 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/48227 (2013.01 - EP US); H01L 2924/00011 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H01L 2924/09701 (2013.01 - EP US); H01L 2924/14 (2013.01 - EP US); H01L 2924/1423 (2013.01 - EP US); H01L 2924/15311 (2013.01 - EP US); H01L 2924/1532 (2013.01 - EP US); H01L 2924/1627 (2013.01 - EP US); H01L 2924/181 (2013.01 - EP US); H01L 2924/30107 (2013.01 - EP US); H05K 1/16 (2013.01 - EP US); H05K 1/185 (2013.01 - EP US); H05K 2201/064 (2013.01 - EP US); H05K 2201/09981 (2013.01 - EP US)
Citation (search report)
See references of WO 2006007803A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2006007803 A1 20060126; CN 101036226 A 20070912; DE 112004002975 A5 20070712; EP 1787326 A1 20070523; US 2008093731 A1 20080424
DOCDB simple family (application)
DE 2004001577 W 20040720; CN 200480043627 A 20040720; DE 112004002975 T 20040720; EP 04762427 A 20040720; US 57221607 A 20070117