EP 1790795 A1 20070530 - Floor System
Title (en)
Floor System
Title (de)
Bodensystem
Title (fr)
Système de plancher
Publication
Application
Priority
EP 05111384 A 20051128
Abstract (en)
The present invention discloses a floor system comprising coupling means (1) for coupling of at least two floor plates (2,2') positioned side by side forming a joint (3) between the floor plates. The floor plate (2) is provided with an engagable portion (4) with an undercut (5), wherein the coupling means (1) has an engaging portion (6) with an engaging part (7) which is dimensioned to, when mounted, extend into said undercut (5) of the engagable portion (4) of the edge side opposite the joint edge of the floor plate (2).
IPC 8 full level
E04F 15/02 (2006.01)
CPC (source: EP)
E04F 15/02 (2013.01); E04F 15/02188 (2013.01); E04F 15/04 (2013.01); E04F 2201/0107 (2013.01); E04F 2201/0517 (2013.01)
Citation (search report)
- [XY] US 6233886 B1 20010522 - ANDRES THOMAS J [US]
- [YA] WO 9313280 A1 19930708 - JUNCKERS AS [DK]
- [YA] US 5303526 A 19940419 - NIESE MICHAEL W [US]
- [YA] PATENT ABSTRACTS OF JAPAN vol. 1995, no. 11 26 December 1995 (1995-12-26)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA HR MK YU
DOCDB simple family (publication)
DOCDB simple family (application)
EP 05111384 A 20051128