Global Patent Index - EP 1794099 A2

EP 1794099 A2 20070613 - METHOD OF FORMING AN IN-SITU RECESSED STRUCTURE

Title (en)

METHOD OF FORMING AN IN-SITU RECESSED STRUCTURE

Title (de)

VERFAHREN ZUR BILDUNG EINER IN-SITU VERTIEFTEN STRUKTUR

Title (fr)

PROCEDE DE FORMATION DE STRUCTURE EN RETRAIT IN SITU

Publication

EP 1794099 A2 20070613 (EN)

Application

EP 05796480 A 20050912

Priority

  • US 2005032276 W 20050912
  • US 94657704 A 20040921
  • US 94657404 A 20040921
  • US 94656604 A 20040921
  • US 94615904 A 20040921
  • US 94656504 A 20040921

Abstract (en)

[origin: WO2006033872A2] The present invention features a method of patterning a substrate that includes forming, on the substrate, a multi-layer film with a surface, an etch rate interface and an etch-differential interface. The etch-differential interface is defined between the etch rate interface and the surface. A recorded pattern is transferred onto the substrate defined, in part, by the etch-differential interface. The recorded pattern has etched pattern characteristics (EPC) that define the shape of the pattern formed for a given etch process or set of etch processes. The etch-differential interface modifies the EPC. By establishing a suitable etch-differential interface, one may obtain a recorded pattern that differs substantially in shape compared with the shape of the patterned layer or the same pattern may be obtained.

IPC 8 full level

H01L 21/308 (2006.01); H01L 21/311 (2006.01); H01L 21/768 (2006.01)

CPC (source: EP KR)

G03F 7/0002 (2013.01 - EP KR); H01L 21/02118 (2013.01 - EP KR); H01L 21/02126 (2013.01 - EP KR); H01L 21/022 (2013.01 - EP KR); H01L 21/02216 (2013.01 - EP KR); H01L 21/02282 (2013.01 - EP KR); H01L 21/0274 (2013.01 - KR); H01L 21/302 (2013.01 - KR); H01L 21/3086 (2013.01 - EP KR); H01L 21/31144 (2013.01 - EP KR); H01L 21/76802 (2013.01 - EP); H01L 21/76811 (2013.01 - EP KR); H01L 21/76817 (2013.01 - EP KR); H01L 21/76819 (2013.01 - EP KR); H01L 21/76838 (2013.01 - EP); H01L 21/76885 (2013.01 - EP KR)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

Designated extension state (EPC)

AL BA HR MK YU

DOCDB simple family (publication)

WO 2006033872 A2 20060330; WO 2006033872 A3 20070222; EP 1794099 A2 20070613; EP 1794099 A4 20081217; EP 2146369 A2 20100120; EP 2146369 A3 20100331; EP 2146370 A2 20100120; EP 2146370 A3 20100331; JP 2008513229 A 20080501; JP 2014150263 A 20140821; JP 5848386 B2 20160127; KR 101243646 B1 20130325; KR 101262730 B1 20130509; KR 20070065334 A 20070622; KR 20120013447 A 20120214; SG 147417 A1 20081128; SG 147418 A1 20081128; SG 147419 A1 20081128; SG 147420 A1 20081128

DOCDB simple family (application)

US 2005032276 W 20050912; EP 05796480 A 20050912; EP 09173395 A 20050912; EP 09173416 A 20050912; JP 2007532387 A 20050912; JP 2014042722 A 20140305; KR 20077006500 A 20050912; KR 20117030614 A 20050912; SG 2008075152 A 20050912; SG 2008075160 A 20050912; SG 2008075178 A 20050912; SG 2008075186 A 20050912