EP 1796863 A1 20070620 - WAVE SOLDERING DEVICE
Title (en)
WAVE SOLDERING DEVICE
Title (de)
VORRICHTUNG ZUM WELLENLÖTEN
Title (fr)
DISPOSITIF DE BRASAGE A LA VAGUE
Publication
Application
Priority
- EP 2005010430 W 20050927
- DE 102004048474 A 20041005
Abstract (en)
[origin: WO2006037520A1] The invention relates to a device for wave soldering workpieces (15), comprising means for moving the workpiece (15) that is to be soldered along a specific path across at least one solder wave (3, 4, 5, 6) generated above a solder reservoir (2), an inert gas atmosphere being created above the solder reservoir (2) so as to largely exclude oxygen. The path extends in such a way that at least one part of the workpiece (15) enters in contact with the solder wave (3, 4, 5, 6). A cap (1) as well as tubes (9, 13) for delivering the inert gas are provided below the workpiece (15). In order to prevent floods, two or more tubes (13) are provided with upward-facing holes or slots that are covered by U-shaped shielding housings (14) which are substantially open towards the bottom.
IPC 8 full level
B23K 1/08 (2006.01); B23K 3/06 (2006.01); H05K 3/34 (2006.01)
CPC (source: EP US)
B23K 1/085 (2013.01 - EP US); B23K 3/0653 (2013.01 - EP US); B23K 2101/42 (2018.08 - EP US)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
DE 102004048474 A1 20060406; EP 1796863 A1 20070620; US 2008067219 A1 20080320; WO 2006037520 A1 20060413
DOCDB simple family (application)
DE 102004048474 A 20041005; EP 05788651 A 20050927; EP 2005010430 W 20050927; US 57662905 A 20050927