EP 1797579 A4 20090415 - MICRODISCHARGE DEVICES WITH ENCAPSULATED ELECTRODES AND METHOD OF MAKING
Title (en)
MICRODISCHARGE DEVICES WITH ENCAPSULATED ELECTRODES AND METHOD OF MAKING
Title (de)
MIKROENTLADEGERÄTE MIT EINGESCHLOSSENEN ELEKTRODEN UND HERSTELLUNGSVERFAHREN DAFÜR
Title (fr)
DISPOSITIFS A MICRODECHARGE COMPRENANT DES ELECTRODES ENCAPSULEES, PROCEDE DE FABRICATION CORRESPONDANT
Publication
Application
Priority
- US 2005035782 W 20051004
- US 95817404 A 20041004
- US 95817504 A 20041004
Abstract (en)
[origin: WO2007011388A2] An embodiment of the invention is a microdischarge device including a first electrode (230) encapsulated in a dielectric, which may be a nanoporous dielectric film. A second electrode (240) is provided which may also be encapsulated with a dielectric. The electrodes are configured to ignite a discharge in a microcavity when a time-varying (an AC, RF, bipolar or a pulsed DC, etc.) potential is applied between the electrodes. In specific embodiments of the invention, the second electrode may be a screen covering the microcavity opening and the microcavity may be closed at one end. In some embodiments of the invention, the second electrode may be in direct contact with the first electrode. In other embodiments, a gap separates the electrodes. In a preferred method of manufacturing microdischarge devices with encapsulated electrodes, a metal substrate is used to form a nanoporous dielectric encapsulated electrode and dissolve a portion of the dielectric layer. The dielectric layer is then anodized a second time, resulting in a nanoporous dielectric encapsulated electrode with improved regularity of the nanoscale dielectric structures. In some embodiments of the invention, the columnar voids in the dielectric may be backfilled with one or more materials to further tailor the properties of the dielectric.
IPC 8 full level
H01J 9/00 (2006.01); H01J 17/04 (2012.01); H01J 61/04 (2006.01)
CPC (source: EP KR)
H01J 9/02 (2013.01 - EP KR); H01J 17/04 (2013.01 - EP KR)
Citation (search report)
- [X] US 2003080688 A1 20030501 - EDEN J GARY [US], et al
- [X] US 2003122466 A1 20030703 - AHN SEONG DEOK [KR], et al
- [X] EP 0931859 A1 19990728 - NIPPON TELEGRAPH & TELEPHONE [JP]
- [X] WO 2004079056 A2 20040916 - FIAT RICERCHE [IT], et al
- [A] US 2002153828 A1 20021024 - YAMANOBE MASATO [JP], et al
- [A] JP 2004178863 A 20040624 - TOSHIBA CORP, et al
- See references of WO 2007011388A2
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2007011388 A2 20070125; WO 2007011388 A3 20070614; EP 1797579 A2 20070620; EP 1797579 A4 20090415; EP 1797579 B1 20150902; JP 2008516380 A 20080515; JP 5435868 B2 20140305; KR 20070060151 A 20070612
DOCDB simple family (application)
US 2005035782 W 20051004; EP 05858440 A 20051004; JP 2007534902 A 20051004; KR 20077010176 A 20070504