EP 1799402 A4 20091216 - METHOD AND APPARATUS FOR IMPROVED CHEMICAL MECHANICAL PLANARIZATION
Title (en)
METHOD AND APPARATUS FOR IMPROVED CHEMICAL MECHANICAL PLANARIZATION
Title (de)
VERFAHREN UND VORRICHTUNG ZUR VERBESSERTEN CHEMISCH-MECHANISCHEN PLANARISIERUNG
Title (fr)
PROCEDE ET APPAREIL DE PLANARISATION CHIMICO-MECANIQUE
Publication
Application
Priority
- US 2005035979 W 20051005
- US 61694404 P 20041006
- US 63925704 P 20041227
Abstract (en)
[origin: WO2006042010A1] A polishing pad includes a guide plate having affixed thereto a porous slurry distribution layer on one side and a flexible under-layer on the other side. A plurality of polishing elements interdigitated with one another through the slurry distribution layer and the guide plate so as to be maintained in planar orientation with respect to one other and the guide plate are affixed to the flexible under-layer and each polishing element protrudes above the surface of the guide plate to which the slurry distribution layer is adjacent. Optionally, a membrane may be positioned between the guide plate and the slurry distribution layer. The polishing pad may also include wear sensors to assist in determinations of pad wear and end-of-life.
IPC 8 full level
B24B 37/04 (2006.01); B24B 37/26 (2012.01); B24D 11/00 (2006.01)
CPC (source: EP KR)
B24B 37/26 (2013.01 - EP); B24D 11/00 (2013.01 - KR)
Citation (search report)
- No further relevant documents disclosed
- See references of WO 2006042010A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2006042010 A1 20060420; EP 1799402 A1 20070627; EP 1799402 A4 20091216; JP 2008516452 A 20080515; JP 5025478 B2 20120912; KR 101165114 B1 20120712; KR 20070057271 A 20070604; TW 200626291 A 20060801; TW I270438 B 20070111
DOCDB simple family (application)
US 2005035979 W 20051005; EP 05808056 A 20051005; JP 2007535807 A 20051005; KR 20077010346 A 20051005; TW 94135023 A 20051006