Global Patent Index - EP 1801314 A1

EP 1801314 A1 20070627 - Profile rail system for covering expansion joints and/or finishing the edges of flooring elements

Title (en)

Profile rail system for covering expansion joints and/or finishing the edges of flooring elements

Title (de)

Profilschienensystem zum Überbrücken von Dehnungsfugen und/oder als Randabschluss bei Bodenbelagselementen

Title (fr)

Système de rails profilés pour recouvrir des joints de dilatation et/ou finir les bords d'éléments de revêtement de sol

Publication

EP 1801314 A1 20070627 (DE)

Application

EP 06026055 A 20061215

Priority

DE 202005020074 U 20051221

Abstract (en)

The profile rail system (1) has at least two telescopic profile rails (5, 6), one of which has a groove (19) and/or spring profiling (15) on a base cover element (2) linked to a groove-spring profile (3, 4). The profile rails can be connected on the face-side with the base cover elements through sliding and pressing of the spring (4, 15) in the opposite-lying groove. The profile rails may have a mount (17) that slidably located in a receiver pocket (16) of the opposite-lying profile rail. The upper surface side of the profile rails may be serrated and may be detachably set on a pedestal rail (7) and be adjustable and adjusted in height on the pedestal rail. The profile rails and the pedestal rail may be connectable by holding means.

IPC 8 full level

E04F 19/06 (2006.01); E04B 1/68 (2006.01); E04F 15/02 (2006.01)

CPC (source: EP KR US)

E04B 1/681 (2013.01 - EP US); E04F 15/02005 (2013.01 - EP KR US); E04F 19/061 (2013.01 - EP KR US); E04F 19/062 (2013.01 - EP KR US); E04F 19/065 (2013.01 - EP KR US); E04F 19/02 (2013.01 - EP US); E04F 2201/0153 (2013.01 - EP KR US)

Citation (search report)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

Designated extension state (EPC)

AL BA HR MK YU

DOCDB simple family (publication)

US 2007137129 A1 20070621; US 7827750 B2 20101109; AT E483079 T1 20101015; AU 2006252153 A1 20070705; AU 2006252153 B2 20090827; BR PI0605328 A 20071009; CA 2570632 A1 20070621; CA 2570632 C 20110920; CN 100516433 C 20090722; CN 1987017 A 20070627; DE 202005020074 U1 20060420; DE 502006007956 D1 20101111; DK 1801314 T3 20110110; EA 009574 B1 20080228; EA 200602162 A1 20070831; EP 1801314 A1 20070627; EP 1801314 B1 20100929; ES 2350944 T3 20110128; HK 1103931 A1 20071228; JP 2007170170 A 20070705; JP 4582655 B2 20101117; KR 100830780 B1 20080519; KR 20070066908 A 20070627; MX PA06015206 A 20081023; NZ 552232 A 20070629; PL 1801314 T3 20110331; PT 1801314 E 20101222; SG 133565 A1 20070730; SI 1801314 T1 20110131; TW 200726884 A 20070716; TW I343957 B 20110621; ZA 200610867 B 20080430

DOCDB simple family (application)

US 64228006 A 20061220; AT 06026055 T 20061215; AU 2006252153 A 20061220; BR PI0605328 A 20061220; CA 2570632 A 20061208; CN 200610168589 A 20061221; DE 202005020074 U 20051221; DE 502006007956 T 20061215; DK 06026055 T 20061215; EA 200602162 A 20061220; EP 06026055 A 20061215; ES 06026055 T 20061215; HK 07108202 A 20070727; JP 2006343015 A 20061220; KR 20060131520 A 20061221; MX PA06015206 A 20061220; NZ 55223206 A 20061220; PL 06026055 T 20061215; PT 06026055 T 20061215; SG 2006089817 A 20061221; SI 200630855 T 20061215; TW 95148120 A 20061221; ZA 200610867 A 20061207